Semiconductor device, manufacturing method therefor, and electronic apparatus

ABSTRACT

A semiconductor device includes: a first semiconductor chip; and a second semiconductor chip that is stacked on the first semiconductor chip. The first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip. The second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip. The respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer.

CROSS REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/216,654, now U.S. Pat. No. 8,536,670 filed Aug. 24, 2011, whichclaims the benefit of Japanese Patent Application No. 2010-196639 filedon Sep. 2, 2010, the entire contents of each of which are herebyincorporated by reference.

BACKGROUND

The present disclosure relates to a semiconductor device such as asolid-state imaging device and a manufacturing method therefore.Further, the disclosure relates to an electronic apparatus such as acamera including a solid-state imaging device.

Electronic apparatuses such as a digital video camera and a digitalstill camera include semiconductor devices such as a solid-state imagingdevice. For example, examples of the solid-state imaging device includea CMOS (Complementary Metal Oxide Semiconductor) image sensor and a CCD(Charge Coupled Device) image sensor.

The solid-state imaging device is configured such that a plurality ofpixels are formed in an array on a surface of a semiconductor substrate.Each pixel is provided with a photoelectric conversion portion. Thephotoelectric conversion portion is, for example, a photodiode, andreceives light, which is incident through an external optical system, ina light receiving surface and photoelectrically converts the light,thereby generating a signal charge.

In the solid-state imaging device, the CMOS image sensor is configuredsuch that each pixel includes not only the photoelectric conversionportion but also a pixel transistor. The pixel transistor includes aplurality of transistors, and reads out the signal charge, which isgenerated by the photoelectric conversion portion, and outputs thesignal charge as an electric signal to a signal line. The CMOS imagesensor has low power consumption, and is thus mostly used in mobileapparatuses such as a camera-mounted mobile phone and a PDA (PersonalDigital Assistant).

As the above-mentioned semiconductor device, there is proposed a“3-dimensional multilayer chip structure” in which a plurality ofsemiconductor chips having different functions are stacked andelectrically connected to each other.

In the “3-dimensional multilayer chip structure”, each circuit can beoptimally formed so as to correspond to the function of the eachsemiconductor chip, and thus it is possible to achieve a high-functionalapparatus. For example, a sensor circuit and a logic circuit areoptimally formed so as to correspond to the respective functions of thesemiconductor chip, which includes the sensor circuit, and thesemiconductor chip, which includes the logic circuit provided with acircuit for processing signals, whereby it is possible to manufacture ahigh-functional solid-state imaging device. Here, by providingpenetration electrodes in the substrate of the semiconductor chip, theplurality of semiconductor chips are electrically connected (Forexample, refer to Japanese Unexamined Patent Application PublicationNos. 2006-49361 and 2007-13089).

SUMMARY

As it is, in the case of a “3-dimensional multilayer chip structure”, itis necessary to make deep through-holes which penetrate through asubstrate while securing insulation, and thus it is difficult to improvemanufacturing efficiency.

For example, in order to form a small hole of which the size is 1 μm, itis necessary to thin the substrate. However, in this case, it isnecessary to separately perform processes such as a process of bondingthe substrate to a supporting substrate before the thinning. Hence,since it is difficult to improve manufacturing efficiency, costs mayincrease. Further, in order to embed a conductive material in the holewith a high aspect ratio, it is necessary to use a conductive material,which is excellent in covering property, such as tungsten. Therefore,sometimes there may be a restriction in the selection of the conductivematerial.

Further, in a case where each semiconductor chip achieves electricalconnection by bonding the surfaces of the circuits to each other, if thesubstrate is thick (for example, a thickness of several hundreds of μm),a process of forming deep holes, a process of forming extractionelectrodes, a process of forming solder balls, and the like arenecessary. Hence, costs may increase.

Further, the stress, which occurs at the time of the bonding, may beconcentrated on a weak part of the bonded surfaces, and cracks may occuron the part. Thus, reliability of the apparatus may deteriorate. When asemiconductor wafer is divided into a plurality of pieces throughdicing, cracks may also occur between the bonded surfaces. Thus, thereliability of the apparatus may also deteriorate.

Otherwise, since it is necessary to secure electrical connection betweena plurality of semiconductor wafers, it is difficult to miniaturize theelectrode pads, and thus it is also difficult to miniaturize the chip.

As described above, in the “3-dimensional multilayer chip structure”, itmay be difficult to improve manufacturing efficiency and lower costs.Otherwise, in the “3-dimensional multilayer chip structure”, it may bedifficult to improve reliability of the apparatus and achieveminiaturization.

Consequently, the disclosure provides a semiconductor device, amanufacturing method therefor, and an electronic apparatus capable ofimproving manufacturing efficiency, lowering costs, improvingreliability of the apparatus, and achieving miniaturization.

According to an embodiment of the disclosure, a semiconductor deviceincludes: a first semiconductor chip; and a second semiconductor chipthat is stacked on the first semiconductor chip. The first semiconductorchip includes a first wiring portion of which a side surface is exposedat a side portion of the first semiconductor chip. The secondsemiconductor chip includes a second wiring portion of which a sidesurface is exposed at a side portion of the second semiconductor chip.The respective side surfaces of the first wiring portion and the secondwiring portion, which are exposed at the side portions of the firstsemiconductor chip and the second semiconductor chip, are covered by aconductive layer, and the first wiring portion and the second wiringportion are electrically connected to each other through the conductivelayer.

It is preferable that the first semiconductor chip should be thinnerthan the second semiconductor chip. It is also preferable that thesecond semiconductor chip should be provided as a supporting substratewhich supports the first semiconductor chip.

It is preferable that, in the first semiconductor chip, pixels, each ofwhich includes a photoelectric conversion portion, should be formed. Itis also preferable that the photoelectric conversion portion should beprovided to receive incident light which is incident from a surface ofthe first semiconductor chip on a side opposite to a surface thereof onwhich the second semiconductor chip is stacked.

It is preferable that the first semiconductor chip should include asemiconductor memory element.

It is preferable that the first semiconductor chip includes asemiconductor element which is formed on an SOI (Silicon on Insulator)substrate.

It is preferable that the second semiconductor chip should include asignal processing circuit.

It is preferable that the first semiconductor chip should have a firstsemiconductor substrate, and a first wiring layer which is stacked onthe first semiconductor substrate and of which the first wiring portionis formed in an insulation layer. It is also preferable that the secondsemiconductor chip should have a second semiconductor substrate, and asecond wiring layer which is stacked on the second semiconductorsubstrate and of which the second wiring portion is formed in aninsulation layer. It is preferable that the first wiring layer and thesecond wiring layer should be opposed to each other, and the opposedsurfaces of the first semiconductor chip and the second semiconductorchip should be bonded to each other.

According to another embodiment of the disclosure, a method ofmanufacturing a semiconductor device includes: a chip stacking processof stacking a second semiconductor chip on a first semiconductor chip; aside surface exposure process of exposing a side surface of a firstwiring portion, which is formed on the first semiconductor chip, and aside surface of a second wiring portion, which is formed on the secondsemiconductor chip, at a side portion of a stacked body in which thefirst semiconductor chip and the second semiconductor chip are stacked;and a conductive layer formation process of electrically connecting thefirst wiring portion and the second wiring portion to each other byproviding a conductive layer so as to cover the side surfaces of thefirst wiring portion and the second wiring portion which are exposed atside portions of the first semiconductor chip and the secondsemiconductor chip.

It is preferable that a process of forming the first semiconductor chipshould include a first wiring layer formation process of stacking afirst wiring layer, of which the first wiring portion is formed in aninsulation layer, on a first semiconductor substrate. It is alsopreferable that a process of forming the second semiconductor chipshould include a second wiring layer formation process of stacking asecond wiring layer, of which the second wiring portion is formed in aninsulation layer, on a second semiconductor substrate. It is alsopreferable that, in the chip stacking process, the first wiring layerand the second wiring layer should be opposed to each other, and theopposed surfaces of the first semiconductor chip and the secondsemiconductor chip should be bonded to each other.

It is preferable that the process of forming the first semiconductorchip should further include a thinning process of thinning the firstsemiconductor substrate. It is also preferable that, in the thinningprocess, the first semiconductor substrate should be thinned after thesecond semiconductor chip is stacked and supported on the firstsemiconductor chip in the stacking of the second semiconductor chip.

It is preferable that the method should further include: a first padsurface exposure process of exposing a surface of a first pad electrodewhich is formed so as to be electrically connected to the first wiringportion at the side portion of the first semiconductor chip; and a firstchip test process of testing the first semiconductor chip by using thefirst pad electrode. It is also preferable that the first pad surfaceexposure process and the first chip test process should be performedbefore the side surface exposure process. It is also preferable that,when the side surfaces of the first wiring portion and the second wiringportion are exposed in the side surface exposure process, the first padelectrode should be removed.

It is preferable that the method further includes: a second pad surfaceexposure process of exposing a surface of a second pad electrode whichis formed so as to be electrically connected to the second wiringportion at the side portion of the second semiconductor chip; and asecond chip test process of testing the second semiconductor chip byusing the second pad electrode. It is also preferable that the secondpad surface exposure process and the second chip test process should beperformed before the side surface exposure process. It is alsopreferable that, when the side surfaces of the first wiring portion andthe second wiring portion are exposed in the side surface exposureprocess, the second pad electrode should be removed.

It is preferable that the method should further include: a substrateprovision process of providing a substrate such that the substrate isopposed to a surface of the first semiconductor chip opposite to asurface thereof on which the second semiconductor chip is stacked. It isalso preferable that the substrate provision process should be performedbetween the first chip test process and the second pad surface exposureprocess.

According to a further embodiment of the disclosure, an electronicapparatus includes: a first semiconductor chip; and a secondsemiconductor chip that is stacked on the first semiconductor chip. Thefirst semiconductor chip includes a first wiring portion of which a sidesurface is exposed at a side portion of the first semiconductor chip.The second semiconductor chip includes a second wiring portion of whicha side surface is exposed at a side portion of the second semiconductorchip. The respective side surfaces of the first wiring portion and thesecond wiring portion, which are exposed at the side portions of thefirst semiconductor chip and the second semiconductor chip, are coveredby a conductive layer, and the first wiring portion and the secondwiring portion are electrically connected to each other through theconductive layer.

According to the embodiments of the disclosure, it is possible toprovide a semiconductor device, a manufacturing method therefor, and anelectronic apparatus capable of improving manufacturing efficiency,lowering costs, improving reliability of the apparatus, and achievingminiaturization.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a configuration diagram illustrating a configuration of acamera 40 according to embodiment 1 of the disclosure;

FIG. 2 is a block diagram illustrating an entire configuration of asolid-state imaging device 1 according to embodiment 1 of thedisclosure;

FIG. 3 is a perspective view illustrating the entire configuration ofthe solid-state imaging device 1 according to embodiment 1 of thedisclosure;

FIG. 4 is a diagram illustrating principal sections of the solid-stateimaging device according to embodiment 1 of the disclosure;

FIG. 5 is a diagram illustrating a pixel P according to embodiment 1 ofthe disclosure;

FIG. 6 is a diagram illustrating the pixel P according to embodiment 1of the disclosure;

FIGS. 7A to 7C are timing charts illustrating pulse signals which aresupplied to the respective sections when the signals are read out fromthe pixel P, according to embodiment 1 of the disclosure;

FIG. 8 is a diagram illustrating a color filter CF according toembodiment 1 of the disclosure;

FIGS. 9A to 9D are diagrams illustrating a method of manufacturing asolid-state imaging device according to embodiment 1 of the disclosure;

FIGS. 10E to 10G are diagrams illustrating the method of manufacturingthe solid-state imaging device according to embodiment 1 of thedisclosure;

FIGS. 11H to 11J are diagrams illustrating the method of manufacturingthe solid-state imaging device according to embodiment 1 of thedisclosure;

FIG. 12 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 13 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 14 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 15 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 16 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 17 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 18 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 19 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 20 is a diagram illustrating the method of manufacturing thesolid-state imaging device according to embodiment 1 of the disclosure;

FIG. 21 is a diagram illustrating principal sections of a semiconductordevice according to embodiment 2 of the disclosure;

FIGS. 22A to 22D are diagrams illustrating the method of manufacturingthe semiconductor device according to embodiment 2 of the disclosure;

FIGS. 23E to 23G are diagrams illustrating the method of manufacturingthe semiconductor device according to embodiment 2 of the disclosure;

FIG. 24 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 2 of the disclosure;

FIG. 25 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 2 of the disclosure;

FIG. 26 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 2 of the disclosure;

FIG. 27 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 2 of the disclosure;

FIG. 28 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 2 of the disclosure;

FIG. 29 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 2 of the disclosure;

FIG. 30 is a diagram illustrating a situation in which particles ofalpha rays or cosmic rays are incident in the semiconductor deviceaccording to embodiment 2 of the disclosure;

FIG. 31 is a diagram illustrating principal sections of a semiconductordevice according to embodiment 3 of the disclosure;

FIGS. 32A to 32D are diagrams illustrating the method of manufacturingthe semiconductor device according to embodiment 3 of the disclosure;

FIGS. 33E to 33G are diagrams illustrating the method of manufacturingthe semiconductor device according to embodiment 3 of the disclosure;

FIG. 34 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 3 of the disclosure;

FIG. 35 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 3 of the disclosure;

FIG. 36 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 3 of the disclosure;

FIG. 37 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 3 of the disclosure;

FIG. 38 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 3 of the disclosure;

FIG. 39 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 3 of the disclosure;

FIG. 40 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 3 of the disclosure;

FIG. 41 is a diagram illustrating the method of manufacturing thesemiconductor device according to embodiment 3 of the disclosure; and

FIG. 42 is a diagram illustrating principal sections of a semiconductordevice according to embodiment 4 of the disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS

Embodiments of the disclosure will be described with reference to theaccompanying drawings.

Furthermore, description will be given in order of the following items.

-   -   1. Embodiment 1 (Image Sensor Chip+Logic Circuit Chip)    -   2. Embodiment 2 (Memory Chip+Logic Circuit Chip)    -   3. Embodiment 3 (SOI High-Speed Device Chip+Logic Circuit Chip)    -   4. Embodiment 4 (Image Sensor Chip+Memory Chip+Logic Circuit        Chip)    -   5. Others

1. Embodiment 1 (A) Configuration of Device

(A-1) Configuration of Principal Sections of Camera

FIG. 1 is a configuration diagram illustrating a configuration of acamera 40 according to embodiment 1 of the disclosure.

As shown in FIG. 1, the camera 40 has a solid-state imaging device 1, anoptical system 42, a driving circuit section 43, and a signal processingsection 44. The respective sections will be described in order ofprecedence.

The solid-state imaging device 1 receives, by an imaging surface PSthereof, incident light H (an object image) which is incident throughthe optical system 42, and photoelectrically converts the light togenerate a signal charge. Here, the solid-state imaging device 1 isdriven on the basis of a control signal which is output from the drivingcircuit section 43. The signal charge is then read and output as rawdata.

The optical system 42 includes optical members such as an imaging lensand an aperture diaphragm, and is disposed to concentrate the incidentlight H onto the imaging surface PS of the solid-state imaging device 1.

The driving circuit section 43 outputs various control signals to thesolid-state imaging device 1 and the signal processing section 44,thereby controlling and driving the solid-state imaging device 1 and thesignal processing section 44.

The signal processing section 44 is configured to perform signalprocessing on electric signals which are output from the solid-stateimaging device 1, thereby generating a digital image.

(A-2) Configuration of Principal Sections of Solid-State Imaging Device

The entire configuration of the solid-state imaging device 1 will bedescribed.

FIG. 2 is a block diagram illustrating the entire configuration of thesolid-state imaging device 1 according to embodiment 1 of thedisclosure.

As shown in FIG. 2, the solid-state imaging device 1 is provided with apixel area PA.

The pixel area PA has, as shown in FIG. 2, a rectangular shape, and aplurality of pixels P are arranged in each of the horizontal direction xand the vertical direction y. That is, the pixels P are arranged in theform of a matrix. In addition, the pixel area PA corresponds to theimaging surface PS shown in FIG. 1. The detailed description of thepixel P will be described later.

Otherwise, the solid-state imaging device 1 is provided with, as shownin FIG. 2, a vertical driving circuit 3, a column circuit 4, ahorizontal driving circuit 5, an external output circuit 7, and a timinggenerator 8 as peripheral circuits.

As shown in FIG. 2, the vertical driving circuit 3 is electricallyconnected to each row of the plurality of pixels P arranged in thehorizontal direction x in the pixel area PA.

The column circuit 4 is configured, as shown in FIG. 2, so as to performsignal processing on the signals which are output from the pixels P inunits of columns. Here, the column circuit 4 includes a CDS (CorrelatedDouble Sampling) circuit (not shown in the drawing), and performs thesignal processing for removing fixed pattern noise.

As shown in FIG. 2, the horizontal driving circuit 5 is electricallyconnected to the column circuit 4. The horizontal driving circuit 5includes, for example, a shift register, and sequentially outputssignals, which are retained for each column of the pixels P in thecolumn circuit 4, to the external output circuit 7.

As shown in FIG. 2, the external output circuit 7 is electricallyconnected to the column circuit 4, performs signal processing on thesignals which are output from the column circuit 4, and then outputs tothe outside. The external output circuit 7 includes an AGC (AutomaticGain Control) circuit 7 a and an ADC circuit 7 b. In the external outputcircuit 7, the AGC circuit 7 a applies a gain to signals, and then theADC circuit 7 b converts analog signals into digital signals, andoutputs the converted signals to the outside.

As shown in FIG. 2, the timing generator 8 is electrically connected toeach of the vertical driving circuit 3, the column circuit 4, thehorizontal driving circuit 5, and the external output circuit 7. Thetiming generator 8 generates various pulse signals, and outputs thesignals to the vertical driving circuit 3, the column circuit 4, thehorizontal driving circuit 5, and the external output circuit 7, therebyperforming driving control on the respective sections.

FIG. 3 is a perspective view illustrating the entire configuration ofthe solid-state imaging device 1 according to embodiment 1 of thedisclosure.

As shown in FIG. 3, in the embodiment, the solid-state imaging device 1has a first semiconductor chip 100 and a second semiconductor chip 200.The first semiconductor chip 100 and the second semiconductor chip 200are opposed to each other. Although a detailed description will be givenlater, the opposed surfaces of the chips are bonded to each other (inthe case of the description in FIG. 3, the chips are separated from eachother). In addition, the first semiconductor chip 100 and the secondsemiconductor chip 200 are electrically connected to each other.

Here, as shown in FIG. 3, the first semiconductor chip 100 is providedwith the pixel area PA. That is, similarly to the above description inFIG. 2, there is provided the pixel area PA in which the plurality ofpixels P are arranged in each of the horizontal direction x and thevertical direction y.

Compared with this, as shown in FIG. 3, the second semiconductor chip200 is provided with a control circuit area 200S and a logic circuitarea 200R.

The control circuit area 200S is provided with, for example, thevertical driving circuit 3 and the timing generator 8 described above inFIG. 2.

In addition, the logic circuit area 200R is provided with, for example,the column circuit 4, the horizontal driving circuit 5, and the externaloutput circuit 7 described above in FIG. 2.

As described above, in the embodiment, the solid-state imaging device 1has a “3-dimensional multilayer chip structure”, and the firstsemiconductor chip 100 and the second semiconductor chip 200 arestacked.

Furthermore, the control circuit area 200S may be provided not in thesecond semiconductor chip 200 but in the first semiconductor chip 100.Further, the second semiconductor chip 200 may be provided with an ISP(image signal processing circuit) or a DSP.

Otherwise, in the solid-state imaging device 1, as shown in FIG. 3, thefirst semiconductor chip 100 and the second semiconductor chip 200 arerespectively provided with scribe areas LA1 and LA2.

The scribe areas LA1 and LA2 are positioned, as shown in FIG. 3, in theperipheral portions on the surfaces (the xy plane) of the firstsemiconductor chip 100 and second semiconductor chip 200 opposed to eachother. Here, the scribe areas LA1 and LA2 include portions which extendin the horizontal direction x and the vertical direction y, and areformed in a rectangular shape in the vicinity of the pixel area PA orthe control circuit area 200S and the logic circuit area 200R.

Although a detailed description will be given later, in a wafer statebefore the dicing, a plurality of areas such as the pixel area PA arearranged alongside one another, and thus the scribe areas LA1 and LA2extend in a line shape between the areas. In addition, a blade is likelyto come into contact with the scribe areas LA1 and LA2, and thus thescribe areas LA1 and LA2 are divided in the solid-state imaging device1, which has the areas such as the pixel area PA mentioned above,through dicing.

(A-3) Specific Configuration of Solid-State Imaging Device

A specific configuration of the solid-state imaging device according tothe embodiment will be described.

FIG. 4 is a diagram illustrating principal sections of the solid-stateimaging device according to embodiment 1 of the disclosure. FIG. 4 showsa cross-sectional surface of the end portion of the solid-state imagingdevice.

As shown in FIG. 4, the solid-state imaging device 1 includes the firstsemiconductor chip 100, the second semiconductor chip 200, a glasssubstrate 300, an insulation film 400, a conductive layer 401, and abump 402.

The respective sections will be described in order of precedence.

(A-3-1) Regarding First Semiconductor Chip 100

The first semiconductor chip 100 includes, as shown in FIG. 4, asemiconductor substrate 101 and a wiring layer 111, where the wiringlayer 111 is provided on the surface of the semiconductor substrate 101.

The first semiconductor chip 100 is opposed to the second semiconductorchip 200, and is bonded to the second semiconductor chip 200 through thesurfaces opposed to each other. Here, in the second semiconductor chip200, similarly to the first semiconductor chip 100, a wiring layer 211is provided on the surface of a semiconductor substrate 201. Thus, thewiring layer 111 of the first semiconductor chip 100 is disposed to beopposed to the wiring layer 211 of the second semiconductor chip 200. Inaddition, the first semiconductor chip 100 and the second semiconductorchip 200 are bonded to each other through the surfaces on which thewiring layers 111 and 211 are opposed to each other.

Further, in the first semiconductor chip 100, as shown in FIG. 4, theglass substrate 300 is bonded to the surface of the first semiconductorchip 100 which is opposite to the surface thereof opposed to the secondsemiconductor chip 200.

Here, as shown in FIG. 4, in the first semiconductor chip 100, the glasssubstrate 300 is bonded by the adhesive layer 301 to the surface of thesemiconductor substrate 101, which constitutes the first semiconductorchip 100, opposite to the surface thereof on which the wiring layer 111is stacked.

In addition, in the first semiconductor chip 100, as shown in FIG. 4,the side portion of the semiconductor substrate 101 is covered by theinsulation film 400. Further, in the first semiconductor chip 100, theside portion of the wiring layer 111 is covered by the conductive layer401.

The first semiconductor chip 100 is formed to be thinner than the secondsemiconductor chip 200. Specifically, in the first semiconductor chip100, the semiconductor substrate 101 is a silicon substrate, and isformed as, for example, a thin film with a thickness of about 1 to 20μm.

In addition, as shown in FIG. 4, the semiconductor substrate 101 isprovided with the pixels P.

FIGS. 5 and 6 are diagrams illustrating the pixel P according toembodiment 1 of the disclosure.

Here, FIG. 5 is a diagram of the upper surface of the pixel P. Further,FIG. 6 is a diagram illustrating a circuit configuration of the pixel P.

As shown in FIGS. 5 and 6, the pixel P includes a photodiode 21 and apixel transistor Tr. Here, the pixel transistor Tr includes a transfertransistor 22, an amplifier transistor 23, a selection transistor 24,and a reset transistor 25, and is configured to perform an operation ofreading the signal charge from the photodiode 21.

(a) Photodiode 21

In the pixels P constituting the first semiconductor chip 100, aplurality of photodiodes 21 are arranged to correspond to the pluralityof pixels P shown in FIG. 2. That is, on the imaging surface (the xyplane), the photodiodes 21 are arranged in each of the horizontaldirection x and the vertical direction y orthogonal to the horizontaldirection x.

The photodiodes 21 are provided, as shown in FIG. 4, in thesemiconductor substrate 101, and receive the incident light H through alight receiving surface JS and photoelectrically convert the light,thereby generating the signal charge.

For example, in the semiconductor substrate 101, each photodiode 21includes a charge storage area (not shown in the drawing) in whichn-type impurities are dispersed. In addition, a hole storage area (notshown in the drawing), in which p-type impurities are dispersed, isformed to suppress occurrence of dark current on each interface on theupper and lower surface sides of the n-type charge storage area.

In the semiconductor substrate 101, as shown in FIG. 4, pixel isolationportions PB, in which p-type impurities are dispersed, are provided toelectrically isolate the plurality of pixels P from each other. Thus,the photodiodes 21 are provided in areas partitioned by the pixelisolation portions PB.

For example, as shown in FIG. 5, the pixel isolation portions PB areformed to be interposed between the plurality of pixels P. That is, thepixel isolation portions PB are formed in a lattice shape in plan view,each photodiode 21 is formed in the area which is partitioned by eachpixel isolation portion PB.

As shown in FIG. 6, the anode of the photodiode 21 is grounded, and thusthe stored signal charge (here, electrons) is read out by the pixeltransistor Tr, and is output as an electric signal to a vertical signalline 27. Specifically, the photodiode 21 is connected, as shown in FIG.6, to the gate of the amplifier transistor 23 through the transfertransistor 22. In addition, in the photodiode 21, the stored signalcharge is transferred as an output signal to a floating diffusion FD,which is connected to the gate of the amplifier transistor 23, by thetransfer transistor 22.

As shown in FIG. 4, a color filter CF and an on-chip lens ML areprovided on the rear surface opposite to the surface on which the wiringlayer 111 is provided in the semiconductor substrate 101. Thus, thephotodiode 21 receives the incident light H which is incident throughthe above-mentioned members. That is, the first semiconductor chip 100is a “backside illuminated type” image sensor chip.

Furthermore, although not shown in the drawing, OPB pixels, in which alight shielding film (not shown in the drawing) is provided on the lightreceiving surfaces JS of the photodiodes 21, are provided around thepixel area PA, thereby obtaining a signal of a black reference level.

(b) Pixel Transistor Tr

In the pixels P constituting the first semiconductor chip 100, aplurality of pixel transistors Tr are arranged to correspond to theplurality of pixels P shown in FIG. 2.

Each pixel transistor Tr includes, as shown in FIGS. 5 and 6, thetransfer transistor 22, the amplifier transistor 23, the selectiontransistor 24, and the reset transistor 25.

The transfer transistor 22 constituting the pixel transistor Tr isprovided, as shown in FIG. 4, on the surface of the semiconductorsubstrate 101 covered by the wiring layer 111. Although the othertransistors 23 to 25 constituting the pixel transistor Tr are not shownin FIG. 4, similarly to the transfer transistor 22, the transistors arealso provided on the surface of the semiconductor substrate 101 coveredby the wiring layer 111.

For example, the transistors 22 to 25 are formed, as shown in FIGS. 4and 5, on the pixel isolation portion PB which isolates pixels P fromeach other in the semiconductor substrate 101.

For example, each of the transistors 22 to 25 is an N-channel MOStransistor, and each gate is formed of, for example, polysilicon. Inaddition, the transistors 22 to 25 are covered by the wiring layer 111.

In the pixel transistor Tr, the transfer transistor 22 is configured tooutput the signal charge, which is generated in the photodiode 21, as anelectric signal to the gate of the amplifier transistor 23.Specifically, the transfer transistor 22 is provided, as shown in FIG.6, so as to be interposed between the photodiode 21 and the floatingdiffusion FD. In addition, at the time of transferring the transfersignal from the transfer line 26 to the gate of the transfer transistor22, the transfer transistor 22 transfers the signal charge, which isstored in the photodiode 21, as an output signal to the floatingdiffusion FD.

In the pixel transistor Tr, the amplifier transistor 23 is configured toamplify and output the electric signal which is output from the transfertransistor 22. Specifically, the gate of the amplifier transistor 23 isconnected, as shown in FIG. 6, to the floating diffusion FD. Further,the drain of the amplifier transistor 23 is connected to a power-sourcepotential supply line Vdd, and the source thereof is connected to theselection transistor 24. The amplifier transistor 23 is supplied withconstant current from the constant-current source I when the selectiontransistor 24 performs selection so as to be turned on, and is therebyoperated as a source follower. Hence, the amplifier transistor 23amplifies the output signal, which is output from the floating diffusionFD, when a selection signal is supplied to the selection transistor 24.

In the pixel transistor Tr, the selection transistor 24 is configured tooutput the electric signal, which is output by the amplifier transistor23, to the vertical signal line 27 when receiving an input of theselection signal. Specifically, the gate of the selection transistor 24is connected, as shown in FIG. 6, to an address line 28 to which theselection signal is supplied. The selection transistor 24 is turned onwhen being supplied with the selection signal, and outputs the outputsignal, which is amplified by the amplifier transistor 23 as describedabove, to the vertical signal line 27.

In the pixel transistor Tr, the reset transistor 25 is configured toreset the gate potential of the amplifier transistor 23. Specifically,the gate of the reset transistor 25 is connected, as shown in FIG. 6, areset line 29 to which a reset signal is supplied. Further, the drain ofthe reset transistor 25 is connected to the power-source potentialsupply line Vdd, and the source thereof is connected to the floatingdiffusion FD. In addition, the reset transistor 25 resets the gatepotential of the amplifier transistor 23 to the power-source potentialthrough the floating diffusion FD when the reset signal is supplied fromthe reset line 29 to the gate thereof.

FIGS. 7A to 7C are timing charts illustrating pulse signals which aresupplied to the respective sections when a signal is read out from eachpixel P in embodiment 1 of the disclosure. FIG. 7A shows the selectionsignal, FIG. 7B shows the reset signal, and FIG. 7C shows the transfersignal.

First, as shown in FIGS. 7A to 7C, at the first time point t1, theselection transistor 24 becomes conductive. In addition, at the secondtime point t2, the reset transistor 25 becomes conductive. Thereby, thereset transistor 25 resets the gate potential of the amplifiertransistor 23.

Next, at the third time point t3, the reset transistor 25 becomesnonconductive. In addition, thereafter, a voltage corresponding to thereset level is read out to the column circuit 4.

Next, at the fourth time point t4, the transfer transistor 22 becomesconductive, and then transfers the signal charge, which is stored in thephotodiode 21, to the gate of the amplifier transistor 23.

Next, at the fifth time point t5, the transfer transistor 22 becomesnonconductive. In addition, thereafter, a voltage with a signal level,which corresponds to the amount of the stored signal charge, is read outto the column circuit 4.

The column circuit 4 performs differential processing on the resetlevel, which is read first, and the signal level which is readsubsequently, and stores the signals. Thereby, fixed pattern noise,which is caused by fluctuation in Vth of each of the transistorsprovided for each pixel P, is canceled.

Since the respective gates of the transistors 22, 24, and 25 areconnected in the row unit which is formed of the plurality of pixels Parranged in the horizontal direction x, the operation for driving thepixels as described above is simultaneously performed on the pluralityof pixels P which are arranged in the row unit. Specifically, on thebasis of the selection signal which is supplied by the above-mentionedvertical driving circuit 3, the selection is sequentially performed inthe vertical direction in units of the horizontal lines (the pixelrows). In addition, on the basis of various timing signals which areoutput from the timing generator 8, the transistors of the pixels arecontrolled. Thereby, the output signals from pixels are read out to thecolumn circuit 4 for each pixel column through the vertical signal line27.

In addition, the signals, which are stored in the column circuit 4, areselected by the horizontal driving circuit 5, and are sequentiallyoutput to the external output circuit 7.

(c) Wiring Layer 111

In the first semiconductor chip 100, the wiring layer 111 is provided,as shown in FIG. 4, on the surface (the upper surface in FIG. 4) of thesemiconductor substrate 101 opposite to the rear surface (the lowersurface in FIG. 4) thereof on which the respective sections such as thecolor filter CF are provided.

The wiring layer 111 includes, as shown in FIG. 4, a plurality of wiringportions 111 h and an insulation layer 111 z, and is provided such thatthe plurality of wiring portions 111 h are covered by the insulationlayer 111 z.

In the wiring layer 111, each wiring portion 111 h is appropriatelyformed to be electrically connected to each pixel P.

Here, the respective wiring portions 111 h are formed by stacking thewiring portions in the insulation layer 111 z so as to function aswiring portions such as the transfer line 26, the address line 28, thevertical signal line 27, and the reset line 29 shown in FIG. 6.

Otherwise, in the side portion of the wiring layer 111, the wiringportions 111 h are formed to extend from the inside of the wiring layer111 to the side portion thereof. These wiring portions 111 h areprovided, as shown in FIG. 4, such that the side surfaces of the wiringportions 111 h are exposed on the sidewall surface of the wiring layer111.

In the embodiment, in the side portion of the wiring layer 111, theplurality of wiring portions 111 h are provided to be stacked withintervals in the depth direction z. Accordingly, the plurality of wiringportions 111 h are provided such that the respective side surfacesthereof are exposed.

(d) Color Filter CF

In the first semiconductor chip 100, the color filter CF is provided, asshown in FIG. 4, on the rear surface (the lower surface in FIG. 4) sideof the semiconductor substrate 101. In addition, on-chip lenses ML arestacked on the color filter CF.

The color filter CF makes the incident light H have colors, andtransmits the light onto the light receiving surfaces JS of thesemiconductor substrate 101. For example, the color filter CF may beformed as follows. A coated film is formed by coating a coating liquid,which includes a color pigment and a photoresist resin, in a coatingmethod such as a spin coat method, and then patterns are formed on thecoated film by using a lithography technique, thereby forming the colorfilter CF.

FIG. 8 is a diagram illustrating the color filter CF according toembodiment 1 of the disclosure. FIG. 8 shows the upper surface of thecolor filter CF.

As shown in FIG. 8, the color filter CF includes a red filter layer CFR,green filter layers CFG, and a blue filter layer CFB. The red filterlayer CFR, the green filter layers CFG, and the blue filter layers CFBare adjacent to each other, and each one thereof corresponds to each ofthe plurality of pixels P.

Here, as shown in FIG. 8, the red filter layer CFR, the green filterlayers CFG, and the blue filter layer CFB are formed in a Bayer arrayBH. That is, the plurality of green filter layers CFG are arranged in acheckered pattern in the diagonal direction. In addition, the red filterlayer CFR and the blue filter layer CFB are arranged in the diagonaldirection symmetrically to that of the plurality of green filter layersCFG.

Specifically, in the color filter CF, the red filter layer CFR has ahigh optical transmittance in a wavelength region (for example, 625 to740 nm) corresponding to the red color, and is configured to make theincident light have the red color and transmit the light onto the lightreceiving surface JS. For example, the red filter layer CFR is formed ina rectangular shape in plan view.

Further, in the color filter CF, the green filter layer CFG has a highoptical transmittance in a wavelength region (for example, 500 to 565nm) corresponding to the green color, and is configured to make theincident light have the green color and transmit the light onto thelight receiving surface JS. For example, the green filter layer CFG isformed in a rectangular shape in plan view.

In the color filter CF, the blue filter layer CFB has a high opticaltransmittance in a wavelength region (for example, 450 to 485 nm)corresponding to the blue color, and is configured to make the incidentlight have the blue color and transmit the light onto the lightreceiving surface JS. For example, the blue filter layer CFB is formedin a rectangular shape in plan view.

(e) On-Chip Lens ML

In the first semiconductor chip 100, the on-chip lenses ML are provided,as shown in FIG. 4, on the rear surface (the lower surface in FIG. 4) ofthe semiconductor substrate 101.

Here, a plurality of on-chip lenses ML are provided to correspond to therespective pixels P on the upper surface of the color filter CF.

Each on-chip lens ML is a convex lens which is formed such that thecenter thereof is thicker than the periphery thereof above the lightreceiving surface JS, and is configured to concentrate the incidentlight H onto the light receiving surface JS of the photodiode 21.

For example, the on-chip lens ML is formed by forming patterns on aphotosensitive resin film through a photolithography technique andsubsequently forming the patterns in lens shapes through a reflowprocess. Otherwise, by forming a resist film having lens shapes on alens material film and subsequently performing an etch-back processthereon, the on-chip lens ML may be formed.

(A-3-2) Regarding Second Semiconductor Chip 200

The second semiconductor chip 200 includes, as shown in FIG. 4, asemiconductor substrate 201 and a wiring layer 211, where the wiringlayer 211 is provided on the surface of a semiconductor substrate 201.

The second semiconductor chip 200 is opposed to the first semiconductorchip 100, and is bonded to the first semiconductor chip 100 through thesurfaces opposed to each other. Here, in the second semiconductor chip200, the wiring layer 211 is disposed to be opposed to the wiring layer111 of the first semiconductor chip 100. In addition, the opposedsurfaces of the wiring layers 111 and 211 are bonded to each other. Thesecond semiconductor chip 200 is provided to be thicker than the firstsemiconductor chip 100 and function as a supporting substrate whichsupports the first semiconductor chip 100 formed as a thin film.

In addition, in the second semiconductor chip 200, as shown in FIG. 4,the side portion of the semiconductor substrate 201 is covered by theinsulation film 400. Further, in the second semiconductor chip 200, thearea from the side portion of the wiring layer 211 to the upper surfaceis covered by the conductive layer 401.

(a) Semiconductor Element 220

In the second semiconductor chip 200, as shown in FIG. 4, semiconductorelements 220 are provided on the semiconductor substrate 201 which is asilicon substrate.

Each semiconductor element 220 is, for example, an MOS transistor, andthe gate thereof is formed of, for example, polysilicon.

As shown in FIG. 3, the second semiconductor chip 200 is provided with acontrol circuit area 200S and a logic circuit area 200R, and thecircuits (refer to FIG. 2) such as the vertical driving circuit 3 formedin the areas are constituted by the semiconductor elements 220.

In addition, the semiconductor elements 220 are covered, as shown inFIG. 4, by the wiring layer 211.

(b) Wiring Layer 211

In the second semiconductor chip 200, the wiring layer 211 is provided,as shown in FIG. 4, on the surface (the upper surface in FIG. 4) of thesemiconductor substrate 201 on which the semiconductor elements 220 areprovided.

The wiring layer 211 includes, as shown in FIG. 4, wiring portions 211 hand an insulation layer 211 z, and is formed such that the wiringportions 211 h are electrically connected to the circuits (refer to FIG.2) such as the vertical driving circuit 3 constituted by thesemiconductor elements 220 in the insulation layer 211 z.

Further, the respective wiring portions 211 h are provided, as shown inFIG. 4, such that the side surfaces of the wiring portions 211 h areexposed on the sidewall surface of the wiring layer 211. Specifically,in the side portion of the wiring layer 211, the plurality of wiringportions 211 h are provided to be stacked with intervals in the depthdirection z. Accordingly, the plurality of wiring portions 211 h areprovided such that the respective side surfaces thereof are exposed.

(A-3-3) Others

The insulation film 400 is provided, as shown in FIG. 4, so as to coverthe side portion of the semiconductor substrate 101 constituting thefirst semiconductor chip 100. Further, the insulation film 400 isprovided to cover the area from the side portion to the upper surface ofthe semiconductor substrate 201 constituting the second semiconductorchip 200.

The conductive layer 401 is formed, as shown in FIG. 4, to cover theside portion of the wiring layer 111 constituting the firstsemiconductor chip 100. Further, the conductive layer 401 is also formedto cover the side portion of the wiring layer 211 constituting thesecond semiconductor chip 200.

Specifically, as shown in FIG. 4, in the respective wiring layers 111and 211 of the first semiconductor chip 100 and the second semiconductorchip 200, the side surfaces of the wiring portions 111 h and 211 h areexposed on the sidewall surface, and the exposed side surfaces of thewiring portions 111 h and 211 h are covered by the conductive layer 401.Here, the conductive layer 401 is integrally formed between both exposedside surfaces of the wiring portions 111 h and 211 h so as toelectrically connect both wiring portions 111 h and 211 h on thesidewall surface.

Further, as shown in FIG. 4, the conductive layer 401 is formed toextend from the side portion to the upper surface of the wiring layer211 constituting the second semiconductor chip 200 with the insulationfilm 400 interposed therebetween. In addition, in the semiconductorsubstrate 201 constituting the second semiconductor chip 200, a bump 402is provided on the surface opposite to the surface, on which the wiringlayer 211 is provided, with the insulation film 400 and the conductivelayer 401 interposed therebetween.

(B) Manufacturing Method

Hereinafter, principal sections of a method of manufacturing thesolid-state imaging device 1 will be described.

FIGS. 9A to 20 are diagrams illustrating a method of manufacturing asolid-state imaging device according to embodiment 1 of the disclosure.

Here, FIGS. 9A to 11J sequentially show processes of manufacturing thesolid-state imaging device.

FIGS. 12E to 16J are diagrams illustrating principal sections of thesolid-state imaging device which is formed by the processes shown inFIGS. 9A to 11J, and show, similarly to FIG. 4, the cross-sectionalsurface of the end portion of the solid-state imaging device.

Specifically, FIG. 12 shows a part of the diagram shown in FIG. 10E inan enlarged manner. FIG. 13 shows a part of the diagram shown in FIG.10F in an enlarged manner. FIG. 14 shows a part of the diagram shown inFIG. 10G in an enlarged manner. FIG. 15 shows a part of the diagramshown in FIG. 10H in an enlarged manner. FIG. 16 shows a part of thediagram shown in FIG. 10I in an enlarged manner. FIG. 17 shows a part ofthe diagram shown in FIG. 10J in an enlarged manner.

In addition, FIGS. 18 to 20 show processes of manufacturing thesolid-state imaging device subsequent to the processes of FIGS. 9A to11J. FIGS. 18 to 20 show, similarly to FIG. 4, a cross-sectional surfaceof the end portion of the solid-state imaging device.

In the embodiment, as shown in FIGS. 9A to 20, a wafer, in which aplurality of solid-state imaging devices 1 are provided, is dividedthrough the processes of (a) to (m), and the solid-state imaging devices1 shown in FIG. 4 and the like are manufactured.

The detailed description of the processes will be described.

(a) Formation of Wiring Layer 111 of First Semiconductor Chip 100

First, as shown in FIG. 9A, the wiring layer 111 of the firstsemiconductor chip 100 is formed.

Although not shown in FIG. 9A, before formation of the wiring layer 111,the pixels P, which constitute the first semiconductor chip 100, areformed on the semiconductor substrate 101 of which the thickness is, forexample, several hundreds of μm (refer to FIG. 4 and the like).

Here, the respective sections such as the photodiode 21 and the pixeltransistor Tr, which include the transfer transistor 22 and the like,are formed in the semiconductor substrate 101 for each area for formingthe plurality of first semiconductor chips 100. Specifically, thesemiconductor substrate 101 undergoes a process of implanting ions ofimpurities and the like, thereby forming the respective sections such asthe photodiode 21 and the pixel transistor Tr.

In addition, as shown in FIG. 9A, the wiring layer 111 is formed tocover one surface of the semiconductor substrate 101.

Here, as shown in FIG. 4, the wiring layer 111 is formed to also coverthe surface on which the pixel transistor Tr such as the transfertransistor 22 is provided. Specifically, by alternately stacking thewiring portions 111 h and the interlayer insulation film, the wiringlayer 111 is formed.

In such a manner, by performing a “first wiring layer formation process”of stacking the wiring layer 111, in which the wiring portions 111 h areformed in the insulation layer 111 z, on the semiconductor substrate101, a part of the first semiconductor chip 100 as an imaging sensorchip is formed.

(b) Formation of Wiring Layer 211 of Second Semiconductor Chip 200

Next, as shown in FIG. 9B, the wiring layer 211 of the secondsemiconductor chip 200 is formed.

Although not shown in FIG. 9B, before formation of the wiring layer 211,the semiconductor elements 220, which constitute the secondsemiconductor chip 200, are formed on the semiconductor substrate 201 ofwhich the thickness is, for example, several hundreds of μm (refer toFIG. 4 and the like).

Here, the semiconductor elements 220 such as MOS transistors are formedin the semiconductor substrate 201 for each area for forming theplurality of second semiconductor chips 200. Specifically, thesemiconductor substrate 201 undergoes a process of implanting ions ofimpurities and the like, thereby forming the semiconductor elements 220.

In addition, as shown in FIG. 9B, the wiring layer 211 is formed tocover one surface of the semiconductor substrate 201.

Here, as shown in FIG. 4, the wiring layer 211 is formed to also coverthe surface on which the semiconductor elements 220 such as the MOStransistors are provided. Specifically, by alternately stacking thewiring portions 211 h and the interlayer insulation film, the wiringlayer 211 is formed.

In such a manner, by performing a second wiring layer formation processof stacking the wiring layer 211, in which the wiring portions 211 h areformed in the insulation layer 211 z, on the semiconductor substrate201, the second semiconductor chip 200 is formed.

(c) Bonding of Semiconductor Substrates 101 and 201

Next, as shown in FIG. 9C, two semiconductor substrates 101 and 201 areopposed and bonded to each other.

Here, the wiring layers 111 and 211 of the semiconductor substrates 101and 201 are opposed to each other, and the opposed surfaces are bondedto each other. For example, both are bonded to each other by anadhesive.

Otherwise, the two semiconductor substrates 101 and 201 may be bonded byplasma bonding.

As described above, a “chip stacking process” of stacking the secondsemiconductor chip 200 on the first semiconductor chip 100 is performed.

(d) Thinning of Semiconductor Substrate 101

Next, as shown in FIG. 9D, the semiconductor substrate 101 is thinned.

Here, by polishing the rear surface of the semiconductor substrate 101opposite to the surface thereof on which the wiring layer 111 isprovided, a thinning process is performed on the semiconductor substrate101. In the “thinning process”, in a state where the secondsemiconductor chip 200 is stacked on and is supported by the firstsemiconductor chip 100 in the process, the thinning process is preformedon the semiconductor substrate 101. The treatment ends by using theinsulation film, which is provided on the semiconductor substrate 101,or a high concentration impurity region as a stopper layer.

Thereby, for example, the semiconductor substrate 101 is thinned suchthat the thickness thereof is 2 to 10 μm.

Thereafter, although not shown in FIG. 9D, as shown in FIG. 4, therespective sections such as the color filter CF and the on-chip lens MLare formed.

(e) Formation of Groove TR1

Next, as shown in FIG. 10E, an etching process is performed on thesemiconductor substrate 101 and the wiring layer 111, thereby forminggrooves TR1.

Here, the etching process is performed on the semiconductor substrate101 so as to make holes which penetrate the semiconductor substrate 101.

In addition, the etching process is performed on the wiring layer 111 soas to form recesses which do not penetrate the wiring layer 111.

Specifically, as shown in FIG. 12, the etching process is performed onthe scribe areas LA1 and LA2 (refer to FIG. 3) of the solid-stateimaging device 1 so as to expose the surface of the pad electrode PAD1connected to the wiring portions 111 h, thereby providing the groovesTR1.

In such a manner, a “first pad surface exposure process” of exposing thesurface of the pad electrode PAD1 at the side portion of the firstsemiconductor chip 100 is performed.

(f) Test of First Semiconductor Chip 100

Next, as shown in FIG. 10F, the first semiconductor chip 100 is tested.

Here, a pair of electrometric probers PR is inserted in the groove TR1which is formed by the process, thereby testing the first semiconductorchip 100. That is, in the “first chip test process”, in the state of thewafer in which the plurality of first semiconductor chips 100 areprovided, whether or not each first semiconductor chip 100 is able toexhibit the prescribed characteristics of an image sensor.

Specifically, as shown in FIG. 13, the probers PR come into contact withthe surface of the pad electrode PAD1 which is exposed in the scribeareas LA1 and LA2, thereby measuring the electrical characteristics ofthe first semiconductor chip 100. In addition, on the basis of themeasurement result, in the test of the first semiconductor chip 100,whether the chip has passed the test is determined. If the test ispassed, the procedure advances to the following process. In contrast, ifthe test is failed, for example, manufacturing is stopped.

(g) Provision of Glass Substrate 300

Next, as shown in FIG. 10G, the glass substrate 300 is provided.

Here, the glass substrate 300 is provided on the surface of thesemiconductor substrate 101 opposite to the surface thereof on which thewiring layer 111 is provided.

Specifically, as shown in FIG. 14, the glass substrate 300 is bonded bythe adhesive layer 301.

By providing the glass substrate 300, it is possible to preventparticles, which are generated in subsequent processes such as thedicing process, from mixing in the first semiconductor chip 100. Thus,it is possible to improve reliability of the apparatus and a yieldratio.

(h) Formation of Groove TR2

Next, as shown in FIG. 11H, an etching process is performed on thesemiconductor substrate 201 and the wiring layer 211, thereby forminggrooves TR2.

Here, the etching process is performed on the semiconductor substrate201 so as to make holes which penetrate the semiconductor substrate 201.

In addition, the etching process is performed on the wiring layer 211 soas to remove a part of the wiring layer 211.

Specifically, as shown in FIG. 15, the etching process is performed onthe scribe areas LA1 and LA2 so as to expose the surface of the padelectrode PAD2 which is formed to be connected to the wiring portions211 h, thereby providing the grooves TR2.

In such a manner, a “second pad surface exposure process” of exposingthe surface of the pad electrode PAD2 at the side portion of the secondsemiconductor chip 200 is performed.

(i) Test of Second Semiconductor Chip 200

Next, as shown in FIG. 11I, the second semiconductor chip 200 is tested.

Here, a pair of electrometric probers PR is inserted in the groove TR2which is formed by the process, thereby testing the second semiconductorchip 200. That is, in the “second chip test process”, in the state ofthe wafer in which the plurality of second semiconductor chips 200 areprovided, whether or not each second semiconductor chip 200 is able toexhibit the prescribed characteristics of an image sensor.

Specifically, as shown in FIG. 16, the probers PR come into contact withthe surface of the pad electrode PAD2 which is exposed in the scribeareas LA1 and LA2, thereby measuring the electrical characteristics ofthe second semiconductor chip 200. In addition, on the basis of themeasurement result, in the test of the second semiconductor chip 200,whether the chip has passed the test is determined. If the test ispassed, the procedure advances to the following process. In contrast, ifthe test is failed, for example, manufacturing is stopped.

(j) Formation of Groove TR3

Next, as shown in FIG. 11J, a dicing process is performed on the wiringlayers 111 and 211 and the glass substrate 300, thereby forming groovesTR3.

Here, the dicing process is performed so as to make holes that connectthe grooves TR1, which are formed between the plurality of firstsemiconductor chips 100 in the above-mentioned process flow, to thegrooves TR2 which are formed between the plurality of secondsemiconductor chips 200.

In addition, the dicing process is performed on the glass substrate 300so as to remove a part of the glass substrate 300. That is, a half-cutis performed such that a part of the glass substrate 300 remains.

Specifically, as shown in FIG. 17, the dicing is performed such that, inthe respective wiring layers 111 and 211 of the first semiconductor chip100 and the second semiconductor chip 200, the side surfaces of thewiring portions 111 h and 211 h are exposed on the sidewall surface,thereby forming the grooves TR3.

Thereby, the solid-state imaging device 1, which is formed by bondingthe first semiconductor chip 100 and the second semiconductor chip 200,is combined with a part of the glass substrate 300.

Furthermore, the pad electrodes PAD1 and PAD2, which are used in thetest, are also removed by the polishing at the time of the dicingprocess of exposing the side surfaces of the wiring portions 111 h and211 h.

In such a manner, a “side surface exposure process” is performed. Here,the side surface exposure process is a process of exposing the sidesurfaces of the wiring portions 111 h of the first semiconductor chip100 and the wiring portions 211 h of the second semiconductor chip 200at the side portion of the stacked body in which the first semiconductorchip 100 and the second semiconductor chip 200 are stacked.

(k) Formation of Insulation Film 400

Next, as shown in FIG. 18, the insulation film 400 is formed.

Here, the side portion of the semiconductor substrate 101, whichconstitutes the first semiconductor chip 100, and the area from the sideportion to the upper surface of the semiconductor substrate 201, whichconstitutes the second semiconductor chip 200, are covered by, forexample, resin such as epoxy resin, thereby forming an insulation film400.

In this case, the insulation film 400 is formed such that the sidesurfaces of the wiring portions 111 h and 211 h are still exposed on thesidewall surfaces of the respective wiring layers 111 and 211. Forexample, by using a printing technique of a printed wiring substrate,the insulation film 400 is formed.

(l) Formation of Conductive Layer 401

Next, as shown in FIG. 19, the conductive layer 401 is formed.

Here, the conductive layer 401 is formed to cover both side portions ofthe wiring layer 111, which constitutes the first semiconductor chip100, and the wiring layer 211 which constitutes the second semiconductorchip 200.

That is, the conductive layer 401 is formed such that the conductivelayer 401 electrically interconnects the wiring portions 111 h and 211 hwhich is exposed at the side portions of the wiring layers 111 and 211.Although not shown in the drawing, the conductive layer 401 is formed ina stripe shape so as to correspond to the wiring portions 111 h and 211h such as a power source wiring portion and a signal wiring portion, andthus electrically interconnects the first semiconductor chip 100 and thesecond semiconductor chip 200.

In addition, with such a configuration, the conductive layer 401 isformed to extend from the side portion of the wiring layer 211, whichconstitutes the second semiconductor chip 200, to the upper surface,with the insulation film 400 interposed therebetween. As described, theconductive layer 401 is formed to function as a connection pad on theupper surface of the wiring layer 211.

(m) Formation of Bump 402

Next, as shown in FIG. 20, the bump 402 is formed.

Here, the bump 402 is formed on the surface of the semiconductorsubstrate 201 opposite to the surface thereof on which the wiring layer211 is provided, with the insulation film 400 and the conductive layer401 interposed therebetween. That is, the bump 402 is formed on theportion, in which the conductive layer 401 functions as a connectionpad, on the upper surface of the wiring layer 211.

(n) Separation into Solid-State Imaging Device 1

Next, as shown in FIG. 4, the solid-state imaging devices 1 areseparated.

Here, the wafer, which is provided with the plurality of solid-stateimaging devices 1 each having the first semiconductor chip 100 and thesecond semiconductor chip 200 stacked, is separated into pieces each ofwhich corresponds to each solid-state imaging device 1.

Specifically, the glass substrate 300 is cut into a plurality of piecesalong the grooves TR3, whereby the wafer is separated into thesolid-state imaging devices 1. That is, the glass substrate 300, whichconnects the plurality of solid-state imaging device 1, is separatedinto pieces each of which corresponds to each solid-state imaging device1.

(C) Summary

As described above, in the embodiment, the solid-state imaging device 1as a semiconductor device has the first semiconductor chip 100 and thesecond semiconductor chip 200 which is stacked on the firstsemiconductor chip 100. The first semiconductor chip 100 includes thewiring portions (first wiring portions) 111 h of which the side surfacesare exposed at the side portion thereof. Further, the secondsemiconductor chip 200 includes the wiring portions (second wiringportions) 211 h of which the side surfaces are exposed at the sideportion thereof. In addition, the side surfaces of the respective wiringportions 111 h and 211 h, which are exposed at the side portions of thefirst semiconductor chip 100 and the second semiconductor chip 200, arecovered by the conductive layer 401. That is, the conductive layer 401electrically interconnects the wiring portions 111 h and 211 h (refer toFIG. 4).

As described above, in the embodiment, the plurality of semiconductorchips 100 and 200 are electrically connected at the side wall portion,and thus it is not necessary to provide the pad electrodes on thesurface of the semiconductor substrate in order to electrically connectboth of them. Accordingly, in the embodiment, it is possible to reducethe occupied area of the apparatus, and thus it is possible to easilyachieve miniaturization.

Further, in the embodiment, the second semiconductor chip 200 is stackedon and supported by the first semiconductor chip 100, and then thesemiconductor substrate 101 is thinned. Hence, in the embodiment,thinning can be uniformly performed. Accordingly, it is possible toeasily improve manufacturing efficiency, lower costs, and improvereliability.

Further, in the embodiment, the surface of the pad electrode PAD1 of thefirst semiconductor chip 100 is exposed, and then the firstsemiconductor chip 100 is tested by using the surface of the padelectrode PAD1. In addition, the glass substrate 300 is provided abovethe surface of the pad electrode PAD1. Subsequently, the surface of thepad electrode PAD2 of the second semiconductor chip 200 is exposed, andthen the second semiconductor chip 200 is tested by using the surface ofthe pad electrode PAD2. Hence, both of the first semiconductor chip 100and the second semiconductor chip 200 can be tested. Accordingly, it ispossible to easily improve manufacturing efficiency, lower costs, andimprove reliability.

Furthermore, the above description was given of the case where each ofthe first semiconductor chip 100 and the second semiconductor chip 200is separately tested, but the disclosure is not limited to this. Thetests of the respective chips may be omitted, and the test of theapparatus may be performed in a finally stacked chip state.

2. Embodiment 2 (A) Configuration of Device

FIG. 21 is a diagram illustrating principal sections of a semiconductordevice according to embodiment 2 of the disclosure. FIG. 21 shows,similarly to FIG. 4, a cross-sectional surface of the end portion of thesemiconductor device.

As shown in FIG. 21, the semiconductor device 1 b includes a firstsemiconductor chip 100 b, a second semiconductor chip 200 b, aninsulation film 400, a conductive layer 401, and a bump 402.

As shown in FIG. 21, the semiconductor device 1 b has a “3-dimensionalmultilayer chip structure”, and the first semiconductor chip 100 b andthe second semiconductor chip 200 b are bonded to each other. In theembodiment, similarly to embodiment 1, respective wiring portions 111 hband 211 hb of the first semiconductor chip 100 b and the secondsemiconductor chip 200 b are electrically connected through theconductive layer 401 at the side portions thereof. However, theconfigurations of the first semiconductor chip 100 b and the secondsemiconductor chip 200 b are different from those in embodiment 1. Asdescribed, the embodiment includes the same points as and differentpoints from embodiment 1. Hence, a repeated description of the sameparts is omitted.

(A-1) Regarding First Semiconductor Chip 100 b

The first semiconductor chip 100 b includes, as shown in FIG. 21, asemiconductor substrate 101 b and a wiring layer 111 b, where the wiringlayer 111 b is provided on the surface of the semiconductor substrate101 b.

The first semiconductor chip 100 b is opposed to the secondsemiconductor chip 200 b, and is bonded to the second semiconductor chip200 b through the surfaces opposed to each other. Here, the wiring layer111 b of the first semiconductor chip 100 b is disposed to be opposed tothe wiring layer 211 b of the second semiconductor chip 200 b. Thus, thesurfaces of the wiring layers 111 b and 211 b opposed to each other arebonded to each other.

In addition, in the first semiconductor chip 100 b, as shown in FIG. 21,the side portion of the semiconductor substrate 101 b is covered by theinsulation film 400. Further, in the first semiconductor chip 100 b, theside portion of the wiring layer 111 b is covered by the conductivelayer 401.

In addition, in the first semiconductor chip 100 b, as shown in FIG. 21,semiconductor elements 22 b are provided on a side of the surface onwhich the wiring layer 111 b is provided in the semiconductor substrate101 b.

The semiconductor elements 22 b include MIM capacitors, and are formedto constitute a DRAM chip (a memory chip). For example, eachsemiconductor element 22 b includes the MIM capacitor which is formed byusing Ta₂O₅ or ZrO₂ as a capacitor insulation film. Otherwise, thesemiconductor elements 22 b may be formed to constitute a flash memory.

The wiring layer 111 b includes, as shown in FIG. 21, similarly toembodiment 1, a plurality of wiring portions 111 hb and an insulationlayer 111 zb, and is provided such that the plurality of wiring portions111 hb are covered by the insulation layer 111 zb.

In the wiring layer 111 b, each wiring portion 111 hb is appropriatelyformed to be electrically connected to each semiconductor element 22 b.

Otherwise, as shown in FIG. 21, in the side portion of the wiring layer111 b, the wiring portions 111 hb are formed to extend from the insideof the wiring layer 111 b to the side portion thereof. These wiringportions 111 hb are provided such that the side surfaces of the wiringportions 111 hb are exposed on the sidewall surface of the wiring layer111 b.

Here, the plurality of wiring portions 111 hb are provided to be stackedwith intervals in the depth direction z. Accordingly, the plurality ofwiring portions 111 hb are provided such that the respective sidesurfaces thereof are exposed.

(A-2) Regarding Second Semiconductor Chip 200 b

The second semiconductor chip 200 b includes, as shown in FIG. 21, asemiconductor substrate 201 b and a wiring layer 211 b, where the wiringlayer 211 b is provided on the surface of a semiconductor substrate 201b.

The second semiconductor chip 200 b is opposed to the firstsemiconductor chip 100 b, and is bonded to the first semiconductor chip100 b through the surfaces opposed to each other. Here, in the secondsemiconductor chip 200 b, the wiring layer 211 b is disposed to beopposed to the wiring layer 111 b of the first semiconductor chip 100 b.In addition, the opposed surfaces of the wiring layers 111 b and 211 bare bonded to each other.

In addition, in the second semiconductor chip 200 b, as shown in FIG.21, the side portion of the semiconductor substrate 201 b is covered bythe insulation film 400. Further, in the second semiconductor chip 200b, the side portion of the wiring layer 211 b is covered by theconductive layer 401.

In the second semiconductor chip 200 b, as shown in FIG. 21,semiconductor elements 220 b are provided on the semiconductor substrate201 b which is a silicon substrate. Each semiconductor element 220 b is,for example, an MOS transistor, and the gate thereof is formed of, forexample, polysilicon. The semiconductor elements 220 b are formed toconstitute an arithmetic processing circuit in the second semiconductorchip 200 b.

In addition, the semiconductor elements 220 b are covered, as shown inFIG. 21, by the wiring layer 211 b.

The wiring layer 211 b includes, as shown in FIG. 21, wiring portions211 hb and an insulation layer 211 zb, and is formed such that thewiring portions 211 hb are electrically connected to the circuitsconstituted by the semiconductor elements 220 b and the like in theinsulation layer 211 zb.

Further, the respective wiring portions 211 hb are provided, as shown inFIG. 21, such that the side surfaces of the wiring portions 211 hb areexposed on the sidewall surface of the wiring layer 211 b. Specifically,in the side portion of the wiring layer 211 b, the plurality of wiringportions 211 hb are provided to be stacked with intervals in the depthdirection z. Accordingly, the plurality of wiring portions 211 hb areprovided such that the respective side surfaces thereof are exposed.

(A-3) Others

The insulation film 400 is provided, as shown in FIG. 21, so as to coverthe area from the side portion to the upper surface of the semiconductorsubstrate 101 b constituting the first semiconductor chip 100 b.Further, the insulation film 400 is provided to cover the side portionof the semiconductor substrate 201 b constituting the secondsemiconductor chip 200 b.

The conductive layer 401 is formed, as shown in FIG. 21, to cover theside portion of the wiring layer 111 b constituting the firstsemiconductor chip 100 b. Further, the conductive layer 401 is alsoformed to cover the side portion of the wiring layer 211 b constitutingthe second semiconductor chip 200 b.

Specifically, the conductive layer 401 is integrally formed between bothexposed side surfaces of the wiring portions 111 hb and 211 hb so as toelectrically connect both wiring portions 111 hb and 211 hb on thesidewall surface.

Further, the conductive layer 401 is formed to extend from the sideportion to the upper surface of the wiring layer 111 b constituting thefirst semiconductor chip 100 b with the insulation film 400 interposedtherebetween. In addition, in the semiconductor substrate 101 bconstituting the first semiconductor chip 100 b, a bump 402 is providedon the surface opposite to the surface, on which the wiring layer 111 bis provided, with the insulation film 400 and the conductive layer 401interposed therebetween.

(B) Manufacturing Method

Hereinafter, principal sections of a method of manufacturing thesemiconductor device 1 b will be described.

FIGS. 22A to 29 are diagrams illustrating a method of manufacturing asemiconductor device according to embodiment 2 of the disclosure.

Here, FIGS. 22A to 23G sequentially show processes of manufacturing thesemiconductor device 1 b.

FIGS. 24 to 26 are diagrams illustrating principal sections of thesemiconductor device which are formed by the processes shown in FIGS.22A to 23G, and show, similarly to FIG. 21, the cross-sectional surfaceof the end portion of the semiconductor device 1 b.

Specifically, FIG. 24 shows a part of the diagram shown in FIG. 23E inan enlarged manner. FIG. 25 shows a part of the diagram shown in FIG.23F in an enlarged manner. FIG. 26 shows a part of the diagram shown inFIG. 23G in an enlarged manner.

In addition, FIGS. 27 to 29 show processes of manufacturing thesemiconductor device subsequent to the processes of FIGS. 22A to 23G.FIGS. 27 to 29 show, similarly to FIG. 21, a cross-sectional surface ofthe end portion of the semiconductor device 1 b.

In the embodiment, as shown in FIGS. 22A to 29, a wafer, in which aplurality of semiconductor device 1 b are provided, is divided throughthe processes of (a) to (j), and the semiconductor device 1 b shown inFIG. 21 and the like is manufactured.

The detailed description of the processes will be described.

(a) Formation of Wiring Layer 111 b of First Semiconductor Chip 100 b

First, as shown in FIG. 22A, the wiring layer 111 b of the firstsemiconductor chip 100 b is formed.

Although not shown in FIG. 22A, the semiconductor elements 22 b areformed on the semiconductor substrate 101 b of which the thickness is,for example, several hundreds of μm (refer to FIG. 21 and the like). Inaddition, the wiring layer 111 b is formed to cover one surface of thesemiconductor substrate 101 b.

(b) Formation of Wiring Layer 211 b of Second Semiconductor Chip 200 b

Next, as shown in FIG. 22B, the wiring layer 211 b of the secondsemiconductor chip 200 b is formed.

Although not shown in FIG. 22B, the semiconductor elements 220 b areformed on the semiconductor substrate 201 b (refer to FIG. 21 and thelike). In addition, the wiring layer 211 b is formed to cover onesurface of the semiconductor substrate 201 b.

(c) Bonding of Semiconductor Substrates 101 b and 201 b

Next, as shown in FIG. 22C, two semiconductor substrates 101 b and 201 bare opposed and bonded to each other.

Here, the wiring layers 111 b and 211 b of the semiconductor substrates101 b and 201 b are opposed to each other, and the opposed surfaces arebonded to each other. For example, both are bonded to each other by anadhesive.

(d) Thinning of Semiconductor Substrate 101 b

Next, as shown in FIG. 22D, the semiconductor substrate 101 b isthinned.

Here, by polishing the surface of the semiconductor substrate 101 bopposite to the surface thereof on which the wiring layer 111 b isprovided, a thinning process is performed on the semiconductor substrate101 b.

Thereby, for example, the semiconductor substrate 101 b is thinned suchthat the thickness thereof is 2 to 10 μm.

(e) Formation of Groove TR1

Next, as shown in FIG. 23E, an etching process is performed on thesemiconductor substrate 101 b and the wiring layer 111 b, therebyforming grooves TR1 b.

Here, the etching process is performed on the semiconductor substrate101 b so as to make holes which penetrate the semiconductor substrate101 b.

In addition, the etching process is performed on the wiring layer 111 bso as to form recesses which do not penetrate the wiring layer 111 b.

Specifically, as shown in FIG. 24, the etching process is performed onthe scribe areas of the semiconductor device 1 b so as to expose thesurface of the pad electrode PAD1 connected to the wiring portions 111hb, thereby providing the grooves TR1 b.

(f) Test of First Semiconductor Chip 100 b

Next, as shown in FIG. 23F, the first semiconductor chip 100 b istested.

Here, a pair of electrometric probers PR is inserted in the groove TR1 bwhich is formed by the process, thereby testing the first semiconductorchip 100 b. That is, in the state of the wafer in which the plurality offirst semiconductor chips 100 are provided, whether or not each firstsemiconductor chip 100 b is able to exhibit the prescribedcharacteristics of a memory.

Specifically, as shown in FIG. 25, the probers PR come into contact withthe surface of the pad electrode PAD1 which is exposed in the scribeareas, thereby measuring the electrical characteristics of the firstsemiconductor chip 100 b. In addition, on the basis of the measurementresult, in the test of the first semiconductor chip 100 b, whether thechip has passed the test is determined. If the test is passed, theprocedure advances to the following process. In contrast, if the test isfailed, for example, manufacturing is stopped.

(g) Formation of Groove TR2 b

Next, as shown in FIG. 23G, an etching process is performed on thesemiconductor substrate 201 b and the wiring layer 211 b, therebyforming grooves TR2 b.

Here, the dicing is further performed on the portions of the grooves TR1b which are formed between the plurality of first semiconductor chips100 b through the above-mentioned process, whereby a part of thesemiconductor substrate 201 b is made to remain.

Specifically, as shown in FIG. 26, the dicing is performed such that, inthe respective wiring layers 111 b and 211 b of the first semiconductorchip 100 b and the second semiconductor chip 200 b, the side surfaces ofthe wiring portions 111 hb and 211 hb are exposed on the sidewallsurface, thereby forming the grooves TR2 b.

Thereby, the semiconductor device 1 b, which is formed by bonding thefirst semiconductor chip 100 b and the second semiconductor chip 200 b,is combined with a part of the semiconductor substrate 201 b.

Furthermore, the pad electrode PAD1, which is used in the test, is alsoremoved by the polishing in the dicing process.

(h) Formation of Insulation Film 400

Next, as shown in FIG. 27, the insulation film 400 is formed.

Here, the area from the side portion to the upper surface of thesemiconductor substrate 101 b, which constitutes the first semiconductorchip 100 b, and the side portion of the semiconductor substrate 201 b,which constitutes the second semiconductor chip 200 b, are covered by,for example, resin such as epoxy resin, thereby forming an insulationfilm 400.

In this case, the insulation film 400 is formed such that the sidesurfaces of the wiring portions 111 hb and 211 hb are still exposed onthe sidewall surfaces of the respective wiring layers 111 b and 211 b.For example, by using a printing technique of a printed wiringsubstrate, the insulation film 400 is formed.

(i) Formation of Conductive Layer 401

Next, as shown in FIG. 28, the conductive layer 401 is formed.

Here, the conductive layer 401 is formed to cover both side portions ofthe wiring layer 111 b, which constitutes the first semiconductor chip100 b, and the wiring layer 211 b which constitutes the secondsemiconductor chip 200 b.

That is, the conductive layer 401 is formed such that the conductivelayer 401 electrically interconnects the wiring portions 111 hb and 211hb which are exposed at the side portions of the wiring layers 111 b and211 b.

In addition, with such a configuration, the conductive layer 401 isformed to extend from the side portion of the wiring layer 111 b, whichconstitutes the first semiconductor chip 100 b, to the upper surface,with the insulation film 400 interposed therebetween. As described, theconductive layer 401 is formed to function as a connection pad on theupper surface of the wiring layer 111 b.

(j) Formation of Bump 402

Next, as shown in FIG. 29, the bump 402 is formed.

Here, the bump 402 is formed on the surface of the semiconductorsubstrate 101 b opposite to the surface thereof on which the wiringlayer 111 b is provided, with the insulation film 400 and the conductivelayer 401 interposed therebetween. That is, the bump 402 is formed onthe portion, in which the conductive layer 401 functions as a connectionpad, on the upper surface of the wiring layer 111 b.

(k) Separation into Semiconductor Device 1 b

Next, as shown in FIG. 21, the semiconductor devices 1 b are separated.

Here, the semiconductor substrate 201 b, which connects the plurality ofsemiconductor device 1 b, is separated into pieces each of whichcorresponds to each semiconductor device 1 b.

(C) Summary

As described above, in the embodiment, the semiconductor device 1 b as asemiconductor device has the first semiconductor chip 100 b and thesecond semiconductor chip 200 b which is stacked on the firstsemiconductor chip 100 b. The first semiconductor chip 100 b includesthe wiring portions (first wiring portions) 111 hb of which the sidesurfaces are exposed at the side portion thereof. Further, the secondsemiconductor chip 200 b includes the wiring portions (second wiringportions) 211 hb of which the side surfaces are exposed at the sideportion thereof. In addition, the side surfaces of the respective wiringportions 111 hb and 211 hb, which are exposed at the side portions ofthe first semiconductor chip 100 b and the second semiconductor chip 200b, are covered by the conductive layer 401. That is, the conductivelayer 401 electrically interconnects the wiring portions 111 hb and 211hb (refer to FIG. 21).

As described above, in the embodiment, similarly to embodiment 1, theplurality of semiconductor chips 100 b and 200 b are electricallyconnected at the side wall portion, and thus it is not necessary toprovide the pad electrodes on the surface of the semiconductor substratein order to electrically connect both of them. Accordingly, in theembodiment, it is possible to reduce the occupied area of the apparatus,and thus it is possible to easily achieve miniaturization.

Further, in the embodiment, the first semiconductor chip 100 b, which isa memory chip, is thinned. Hence, it is possible to suppress occurrenceof soft errors which are caused by damage to storage data.

FIG. 30 is a diagram illustrating a situation in which particles ofalpha rays or cosmic rays are incident in the semiconductor device 1 baccording to embodiment 2 of the disclosure.

As shown in FIG. 30, when alpha rays or cosmic rays are incident,electron-hole pairs are generated, thereby damaging storage data in thefirst semiconductor chip 100 b as a memory chip. Thus, soft errors mayoccur.

However, by thinning the first semiconductor chip 100 b, it is possibleto suppress occurrence of electron-hole pairs. Accordingly, it ispossible to suppress occurrence of the soft errors caused by damage tothe storage data, and thus it is possible to improve reliability of theapparatus.

For example, by setting a film thickness of the memory chip in a rangeof 5 to 15 μm, the memory chip has a film thickness equal to 1/10 to1/80 of a film thickness of the normal memory chip. Therefore, it ispossible to reduce a probability of occurrence of the soft errors up to1/10 or less of the probability of the normal memory chip.

3. Embodiment 3 (A) Configuration of Device

FIG. 31 is a diagram illustrating principal sections of a semiconductordevice according to embodiment 3 of the disclosure. FIG. 31 shows,similarly to FIG. 21, a cross-sectional surface of the end portion ofthe semiconductor device.

As shown in FIG. 31, the semiconductor device 1 c includes a firstsemiconductor chip 100 c, a second semiconductor chip 200 c, aninsulation film 400, a conductive layer 401, and a bump 402.

As shown in FIG. 31, the semiconductor device 1 c has a “3-dimensionalmultilayer chip structure”, and the first semiconductor chip 100 c andthe second semiconductor chip 200 c are bonded to each other. In theembodiment, similarly to embodiment 2, respective wiring portions 111 hcand 211 hc of the first semiconductor chip 100 c and the secondsemiconductor chip 200 c are electrically connected through theconductive layer 401 at the side portions thereof. However, theconfigurations of the first semiconductor chip 100 c and the secondsemiconductor chip 200 c are different from those in embodiment 2. Asdescribed, the embodiment includes the same points as and differentpoints from embodiment 2. Hence, a repeated description of the sameparts is omitted.

(A-1) Regarding First Semiconductor Chip 100 c

The first semiconductor chip 100 c includes, as shown in FIG. 31, asemiconductor substrate 101 c and a wiring layer 111 c, where the wiringlayer 111 c is provided on the surface of the semiconductor substrate101 c.

In the first semiconductor chip 100 c, similarly to embodiment 2,semiconductor elements 22 c are provided on a side of the surface onwhich the wiring layer 111 c is provided in the semiconductor substrate101 c.

Here, each semiconductor element 22 c is formed to include, contrary toembodiment 2, for example, an MOS transistor. The embodiment isdifferent from embodiment 2 in that the semiconductor elements 22 c areformed by thinning a SOI (Silicon on Insulator) substrate such that thefirst semiconductor chip 100 c functions as a high-speed device. Forexample, by setting the film thickness of the semiconductor layer to0.05 μm or less, a fully-depleted (FD) SOI device can be formed.Further, by setting the film thickness of the semiconductor layer to 0.1μm or less, a partially-depleted (PD) SOI device can be formed.

Otherwise, the first semiconductor chip 100 c is formed to be the sameas that of embodiment 2.

That is, as shown in FIG. 31, in the side portion of the wiring layer111 c, the wiring portions 111 hc are formed to extend from the insideof the wiring layer 111 c to the side portion thereof. These wiringportions 111 hc are provided such that the side surfaces of the wiringportions 111 hc are exposed on the sidewall surface of the wiring layer111 c.

(A-2) Regarding Second Semiconductor Chip 200 c

The second semiconductor chip 200 c includes, as shown in FIG. 31, asemiconductor substrate 201 c and a wiring layer 211 c, where the wiringlayer 211 c is provided on the surface of a semiconductor substrate 201c.

In the second semiconductor chip 200 c, similarly to embodiment 2,semiconductor elements 220 c are provided on a side of the surface onwhich the wiring layer 211 c is provided in the semiconductor substrate201 c.

The semiconductor elements 220 c are formed, similarly to embodiment 2,so as to constitute an arithmetic processing circuit in the secondsemiconductor chip 200 c.

Otherwise, the second semiconductor chip 200 c is formed to be the sameas that of embodiment 2.

That is, as shown in FIG. 31, in the side portion of the wiring layer211 c, the wiring portions 211 hc are formed to extend from the insideof the wiring layer 211 c to the side portion thereof. These wiringportions 211 hc are provided such that the side surfaces of the wiringportions 211 hc are exposed on the sidewall surface of the wiring layer211 c.

(A-3) Others

The insulation film 400, the conductive layer 401, and the bump 402,which are members other than the first semiconductor chip 100 c and thesecond semiconductor chip 200 c, are provided to be the same as that ofembodiment 2.

(B) Manufacturing Method

Hereinafter, principal sections of a method of manufacturing thesemiconductor device 1 c will be described.

FIGS. 32A to 41 are diagrams illustrating a method of manufacturing asemiconductor device according to embodiment 3 of the disclosure.

Here, FIGS. 32A to 33G sequentially show processes of manufacturing thesemiconductor device 1 c.

FIG. 34 to FIG. 38 are diagrams illustrating principal sections of thesemiconductor device which are formed by the processes shown in FIGS.32A to 33G, and show, similarly to FIG. 31, the cross-sectional surfaceof the end portion of the semiconductor device 1 c.

Specifically, FIG. 34 shows a part of the diagram shown in FIG. 32A inan enlarged manner. FIG. 35 shows a part of the diagram shown in FIG.32D in an enlarged manner. FIG. 36 shows a part of the diagram shown inFIG. 33E in an enlarged manner. FIG. 37 shows a part of the diagramshown in FIG. 33F in an enlarged manner. FIG. 38 shows a part of thediagram shown in FIG. 33G in an enlarged manner.

In addition, FIGS. 39 to 41 show processes of manufacturing thesemiconductor device subsequent to the processes of FIGS. 32A to 33G.FIGS. 39 to 41 show, similarly to FIG. 31, a cross-sectional surface ofthe end portion of the semiconductor device 1 c.

In the embodiment, as shown in FIGS. 32A to 41, a wafer, in which aplurality of semiconductor devices 1 c are provided, is divided throughthe processes of (a) to (j), and the semiconductor device 1 c shown inFIG. 31 and the like is manufactured.

The detailed description of the processes will be described.

(a) Formation of Wiring Layer 111 c of First Semiconductor Chip 100 c

First, as shown in FIG. 32A, the wiring layer 111 c of the firstsemiconductor chip 100 c is formed.

Although not shown in FIG. 32A, for example, the SOI substrate isprovided as the semiconductor substrate 101 c. In addition, thesemiconductor elements 22 c are formed on the semiconductor substrate101 c as the SOI substrate (refer to FIG. 31 and the like).

For example, as shown in FIG. 34, the MOS transistor is formed as thesemiconductor element 22 c.

Specifically, an element isolation portion STI is formed on the upperlayer portion of the semiconductor substrate 101 c (a portion of thesilicon layer of the SOI substrate). The element isolation portion STIis formed by forming a trench on the upper layer portion of thesemiconductor substrate 101 c and subsequently embedding an insulationmaterial inside the trench. For example, SiO₂ and Si₃N₄ may be embeddedfor the formation. That is, the element isolation portion STI is formedin a STI (Shallow Trench Isolation) structure.

Then, the semiconductor element 22 c is provided in the area isolated bythe element isolation portion STI. Here, a gate insulation film 221 z isformed on the upper surface of the semiconductor substrate 101 c, andsubsequently a gate electrode 221 g is provided on the gate insulationfilm 221 z. In addition, by using the gate electrode 221 g as aself-alignment mask, impurities are implanted as ions into thesemiconductor substrate 101 c, whereby source/drain areas 222 a and 222b are formed.

Thereafter, similarly to embodiment 2, the wiring layer 111 c is formedto cover one surface of the semiconductor substrate 101 c.

(b) Formation of Wiring Layer 211 c of Second Semiconductor Chip 200 c

Next, as shown in FIG. 32B, the wiring layer 211 c of the secondsemiconductor chip 200 c is formed.

Although not shown in FIG. 32B, the semiconductor elements 220 c areformed on the semiconductor substrate 201 c (refer to FIG. 31 and thelike). In addition, the wiring layer 211 c is formed to cover onesurface of the semiconductor substrate 201 c.

(c) Bonding of Semiconductor Substrates 101 c and 201 c

Next, as shown in FIG. 32C, two semiconductor substrates 101 c and 201 care opposed and bonded to each other.

Here, the wiring layers 111 c and 211 c of the semiconductor substrates101 c and 201 c are opposed to each other, and the opposed surfaces arebonded to each other. For example, both are bonded to each other by anadhesive.

(d) Thinning of Semiconductor Substrate 101 c

Next, as shown in FIG. 32D, the semiconductor substrate 101 c isthinned.

Here, by polishing the surface of the semiconductor substrate 101 copposite to the surface thereof on which the wiring layer 111 c isprovided, a thinning process is performed on the semiconductor substrate101 c.

Thereby, for example, the semiconductor substrate 101 c is thinned suchthat the thickness thereof is 2 to 10 μm.

Specifically, as shown in FIG. 35, the element isolation portion STI isused as a polishing stopper, and the thinning process is terminated.

(e) Formation of Groove TR1

Next, as shown in FIG. 33E, an etching process is performed on thesemiconductor substrate 101 c and the wiring layer 111 c, therebyforming grooves TR1 c.

Here, the etching process is performed on the semiconductor substrate101 c so as to make holes which penetrate the semiconductor substrate101 c.

In addition, the etching process is performed on the wiring layer 111 cso as to form recesses which do not penetrate the wiring layer 111 c.

Specifically, as shown in FIG. 36, the etching process is performed onthe scribe areas of the plurality of semiconductor chips 100 c so as toexpose the surface of the pad electrode PAD1 connected to the wiringportions 111 hc, thereby providing the grooves TR1 c.

(f) Test of First Semiconductor Chip 100 c

Next, as shown in FIG. 33F, the first semiconductor chip 100 c istested.

Here, a pair of electrometric probers PR is inserted in the groove TR1 cwhich is formed by the process, thereby testing the first semiconductorchip 100 c. That is, in the state of the wafer in which the plurality offirst semiconductor chips 100 c are provided, whether or not each firstsemiconductor chip 100 c is able to exhibit the prescribedcharacteristics of a high-speed device.

Specifically, as shown in FIG. 37, the probers PR come into contact withthe surface of the pad electrode PAD1 which is exposed in the scribeareas, thereby measuring the electrical characteristics of the firstsemiconductor chip 100 c. In addition, on the basis of the measurementresult, in the test of the first semiconductor chip 100 c, whether thechip has passed the test is determined. If the test is passed, theprocedure advances to the following process. In contrast, if the test isfailed, for example, manufacturing is stopped.

(g) Formation of Groove TR2 c

Next, as shown in FIG. 33G, an etching process is performed on thesemiconductor substrate 201 c and the wiring layer 211 c, therebyforming grooves TR2 c.

Here, the dicing is further performed on the portions of the grooves TR1c which are formed between the plurality of first semiconductor chips100 c through the above-mentioned process, whereby a part of thesemiconductor substrate 201 c is made to remain.

Specifically, as shown in FIG. 38, the dicing is performed such that, inthe respective wiring layers 111 c and 211 c of the first semiconductorchip 100 c and the second semiconductor chip 200 c, the side surfaces ofthe wiring portions 111 hc and 211 hc are exposed on the sidewallsurface, thereby forming the grooves TR2 c.

Thereby, the semiconductor device 1 c, which is formed by bonding thefirst semiconductor chip 100 c and the second semiconductor chip 200 c,is combined with a part of the semiconductor substrate 201 c.

Furthermore, the pad electrode PAD1, which is used in the test, is alsoremoved by the polishing in the dicing process.

(h) Formation of Insulation Film 400

Next, as shown in FIG. 39, the insulation film 400 is formed.

Here, the area from the side portion to the upper surface of thesemiconductor substrate 101 c, which constitutes the first semiconductorchip 100 c, and the side portion of the semiconductor substrate 201 c,which constitutes the second semiconductor chip 200 c, are covered by,for example, resin such as epoxy resin, thereby forming an insulationfilm 400.

In this case, the insulation film 400 is formed such that the sidesurfaces of the wiring portions 111 hc and 211 hc are still exposed onthe sidewall surfaces of the respective wiring layers 111 c and 211 c.For example, by using a printing technique of a printed wiringsubstrate, the insulation film 400 is formed.

(i) Formation of Conductive Layer 401

Next, as shown in FIG. 40, the conductive layer 401 is formed.

Here, the conductive layer 401 is formed to cover both side portions ofthe wiring layer 111 c, which constitutes the first semiconductor chip100 c, and the wiring layer 211 c which constitutes the secondsemiconductor chip 200 c.

That is, the conductive layer 401 is formed such that the conductivelayer 401 electrically interconnects the wiring portions 111 hc and 211hc which is exposed at the side portions of the wiring layers 111 c and211 c.

In addition, with such a configuration, the conductive layer 401 isformed to extend from the side portion of the wiring layer 111 c, whichconstitutes the first semiconductor chip 100 c, to the upper surface,with the insulation film 400 interposed therebetween. As described, theconductive layer 401 is formed to function as a connection pad on theupper surface of the wiring layer 111 c.

(j) Formation of Bump 402

Next, as shown in FIG. 41, the bump 402 is formed.

Here, the bump 402 is formed on the surface of the semiconductorsubstrate 101 c opposite to the surface thereof on which the wiringlayer 111 c is provided, with the insulation film 400 and the conductivelayer 401 interposed therebetween. That is, the bump 402 is formed onthe portion, in which the conductive layer 401 functions as a connectionpad, on the upper surface of the wiring layer 111 c.

(k) Separation into Semiconductor Device 1 c

Next, as shown in FIG. 31, the semiconductor devices 1 c are separated.

Here, the semiconductor substrate 201 c, which connects the plurality ofsemiconductor device 1 c, is separated into pieces each of whichcorresponds to each semiconductor device 1 c.

(C) Summary

As described above, in the embodiment, the semiconductor device 1 c as asemiconductor device has the first semiconductor chip 100 c and thesecond semiconductor chip 200 c which is stacked on the firstsemiconductor chip 100 c. The first semiconductor chip 100 c includesthe wiring portions (first wiring portions) 111 hc of which the sidesurfaces are exposed at the side portion thereof. Further, the secondsemiconductor chip 200 c includes the wiring portions (second wiringportions) 211 hc of which the side surfaces are exposed at the sideportion thereof. In addition, the side surfaces of the respective wiringportions 111 hc and 211 hc, which are exposed at the side portions ofthe first semiconductor chip 100 c and the second semiconductor chip 200c, are covered by the conductive layer 401. That is, the conductivelayer 401 electrically interconnects the wiring portions 111 hc and 211hc (refer to FIG. 31).

As described above, in the embodiment, similarly to embodiment 1, theplurality of semiconductor chips 100 c and 200 c are electricallyconnected at the side wall portion, and thus it is not necessary toprovide the pad electrodes on the surface of the semiconductor substratein order to electrically connect both of them. Accordingly, in theembodiment, it is possible to reduce the occupied area of the apparatus,and thus it is possible to easily achieve miniaturization.

4. Embodiment 4 (A) Configuration of Device

FIG. 42 is a diagram illustrating principal sections of a semiconductordevice according to embodiment 4 of the disclosure. FIG. 42 shows,similarly to FIG. 21, a cross-sectional surface of the end portion ofthe semiconductor device.

As shown in FIG. 42, the semiconductor device 1 d includes, similarly toembodiment 2, a first semiconductor chip 100 b, a second semiconductorchip 200 b, an insulation film 400, a conductive layer 401, and a bump402. Otherwise, the semiconductor device 1 d further has, contrary toembodiment 1, a third semiconductor chip 100 d and a glass substrate 300d. In addition, embodiment 4 is different from embodiment 2 in positionsat which the insulation film 400, the conductive layer 401, and the bump402 are respectively provided. As described, the embodiment includes thesame points as and different points from embodiment 2. Hence, a repeateddescription of the same parts is omitted.

As shown in FIG. 42, the semiconductor device 1 d has a “3-dimensionalmultilayer chip structure”, and similarly to embodiment 2, the firstsemiconductor chip 100 b and the second semiconductor chip 200 b arebonded to each other.

Otherwise, the third semiconductor chip 100 d is bonded to a surface ofthe first semiconductor chip 100 b opposite to the surface thereof towhich the second semiconductor chip 200 b is bonded.

The third semiconductor chip 100 d is configured to be the same as thefirst semiconductor chip 100 according to embodiment 1. That is, thethird semiconductor chip 100 d is a “backside illuminated type” imagesensor chip, and includes the semiconductor substrate 101 and the wiringlayer 111, where the wiring layer 111 is provided on the surface of asemiconductor substrate 101.

In addition, as shown in FIG. 42, the glass substrate 300 is bonded tothe surface of the third semiconductor chip 100 d opposite to thesurface thereof opposed to the first semiconductor chip 100 b.

The insulation film 400 is provided, as shown in FIG. 42, so as to coverthe side portion of the semiconductor substrate 101 b constituting thefirst semiconductor chip 100 b. Further, the insulation film 400 isprovided to cover the area from the side portion the lower surface ofthe semiconductor substrate 201 b constituting the second semiconductorchip 200 b. In addition, the insulation film 400 is provided to coverthe side portion of the semiconductor substrate 101 constituting thethird semiconductor chip 100 d.

The insulation film 400 is provided, as shown in FIG. 42, so as to coverthe side portion of the wiring layer 111 b constituting the firstsemiconductor chip 100 b, similarly to embodiment 2. Further, theconductive layer 401 is also formed to cover the side portion of thewiring layer 211 b constituting the second semiconductor chip 200 b.Furthermore, in the embodiment, the conductive layer 401 is also formedto cover the side portion of the wiring layer 111 constituting the thirdsemiconductor chip 100 d.

Specifically, as shown in FIG. 42, in the respective wiring layers 111b, 211 b, and 111 of the first semiconductor chip 100 b, the secondsemiconductor chip 200 b, and the third semiconductor chip 100 d, theside surfaces of the wiring portions 111 hb, 211 hb, and 111 h areexposed on the sidewall surface. The conductive layer 401 integrallycovers the exposed side surfaces of the wiring portions 111 h, 211 h,and 111 so as to electrically connect wiring portions 111 h, 211 h, and111 to each other.

Further, as shown in FIG. 42, the conductive layer 401 is formed toextend from the side portion to the upper surface of the wiring layer211 b constituting the second semiconductor chip 200 b with theinsulation film 400 interposed therebetween. In addition, in thesemiconductor substrate 201 b constituting the second semiconductor chip200 b, a bump 402 is provided on the surface opposite to the surface, onwhich the wiring layer 211 b is provided, with the insulation film 400and the conductive layer 401 interposed therebetween.

Furthermore, in the embodiment, the first semiconductor chip 100 bfunctions as a memory chip for storing data signals which are outputfrom the third semiconductor chip 100 d. Further, the secondsemiconductor chip 200 b functions, similarly to the secondsemiconductor chip 200 of embodiment 1, as a signal processing logicchip for processing data signals which are output from the thirdsemiconductor chip 100 d.

(B) Summary

As described above, in the embodiment, the semiconductor device 1 d as asemiconductor device has not only the first semiconductor chip 100 b andthe second semiconductor chip 200 b but also the third semiconductorchip 100 d which is stacked on the first semiconductor chip 100 b. Thethird semiconductor chip 100 d includes the wiring portions 111 h ofwhich the side surfaces are exposed at the side portion thereof. Inaddition, in the respective wiring portions 111 hb, 211 hb, and 111 h ofthe respective semiconductor chips 100 b, 200 b, and 100 d, the sidesurfaces thereof, which are exposed at the side portions of the chips,are covered by the conductive layer 401. That is, the conductive layer401 electrically interconnects the wiring portions (refer to FIG. 42).

As described above, in the embodiment, similarly to embodiment 2, theplurality of semiconductor chips 100 b, 200 b, and 100 d areelectrically connected at the side wall portion, and thus it is notnecessary to provide the pad electrodes on the surface of thesemiconductor substrate in order to electrically connect the respectivechips. Accordingly, in the embodiment, it is possible to reduce theoccupied area of the apparatus, and thus it is possible to easilyachieve miniaturization.

5. Others

In the application of the disclosure, the disclosure is not limited tothe above-mentioned embodiments, and may employ various modifiedexamples.

In the above descriptions of the embodiments, when the semiconductordevice is the solid-state imaging device, the solid-state imaging deviceis applied to a camera. However, the disclosure is not limited to this.Similarly to a scanner or a copier, the disclosure may be applied toother electronic apparatuses each having the solid-state imaging device.

Further, in the above descriptions of the embodiments, two or threesemiconductor chips are stacked. However, the disclosure is not limitedto this. The disclosure may be applied to a case where four or moresemiconductor chips are stacked.

Otherwise, the respective embodiments may be appropriately combined.

Furthermore, in the embodiments, the solid-state imaging device 1, thesemiconductor devices 1 b, 1 c, and 1 d correspond to the semiconductordevice of the disclosure. Further, in the embodiments, the photodiode 21corresponds to the photoelectric conversion portion of the disclosure.Further, in the embodiments, the first semiconductor chips 100, 100 b,and 100 c and the third semiconductor chip 100 d correspond to the firstsemiconductor chip of the disclosure. Further, in the embodiments, thesecond semiconductor chips 200, 200 b, and 200 c correspond to thesecond semiconductor chip of the disclosure. Further, in theembodiments, the wiring layers 111, 111 b, 111 c, and 111 d correspondto the first wiring layer of the disclosure. Further, in theembodiments, the wiring portions 111 h, 111 hb, 111 hc, and 111 hdcorrespond to the first wiring portion of the disclosure. Further, inthe embodiments, the wiring layers 211, 211 b, and 211 c correspond tothe second wiring layer of the disclosure. Further, in the embodiments,the wiring portions 211 h, 211 hb, and 211 hc correspond to the secondwiring portion of the disclosure. Further, in the embodiments, theconductive layer 401 corresponds to the conductive layer of thedisclosure. Further, in the embodiments, the semiconductor substrates101, 101 b, and 101 c correspond to the first semiconductor substrate ofthe disclosure. Further, in the embodiments, the semiconductorsubstrates 201, 201 b, and 201 c correspond to the second semiconductorsubstrate of the disclosure. Further, in the embodiments, the padelectrode PAD1 corresponds to the first pad electrode of the disclosure.Further, in the embodiments, the pad electrode PAD2 corresponds to thesecond pad electrode of the disclosure. Further, in embodiment 1mentioned above, the process shown in FIG. 9A or the like corresponds tothe first wiring layer formation process of the disclosure. Further, inembodiment 1 mentioned above, the process shown in FIG. 9B or the likecorresponds to the second wiring layer formation process of thedisclosure. Further, in embodiment 1 mentioned above, the process shownin FIG. 9C or the like corresponds to the chip stacking process of thedisclosure. Further, in embodiment 1 mentioned above, the process shownin FIG. 9D or the like corresponds to the thinning process of thedisclosure. Further, in embodiment 1 mentioned above, the process shownin FIG. 10E or the like corresponds to the first pad surface exposureprocess of the disclosure. Further, in embodiment 1 mentioned above, theprocess shown in FIG. 10F corresponds to the first chip test process ofthe disclosure. Further, in embodiment 1 mentioned above, the processshown in FIG. 10G or the like corresponds to the substrate provisionprocess of the disclosure. Further, in embodiment 1 mentioned above, theprocess shown in FIG. 11H or the like corresponds to the second padsurface exposure process of the disclosure. Further, in embodiment 1mentioned above, the process shown in FIG. 11I or the like correspondsto the second chip test process of the disclosure. Further, inembodiment 1 mentioned above, the process shown in FIG. 11J or the likecorresponds to the side surface exposure process of the disclosure.Further, in embodiment 1 mentioned above, the process shown in FIG. 19or the like corresponds to the conductive layer formation process of thedisclosure.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A semiconductor device comprising: a firstsemiconductor chip, including: a first semiconductor substrate; a firstwiring layer having a first wiring portion and a first insulation layer,wherein the first wiring portion extends to a side surface of the firstwiring layer; and a second semiconductor chip that is stacked on thefirst semiconductor chip, including: a second semiconductor substrate; asecond wiring layer having a second wiring portion and a secondinsulation layer, wherein the second wiring portion extends to a sidesurface of the second wiring layer, wherein opposing surfaces of thefirst insulation layer and of the second insulation layer are bonded toone another, and wherein the first and second wiring portions are notexposed at the opposing surfaces of the first and second insulationlayers, and wherein the respective side surfaces of the first wiringportion and the second wiring portion, which are exposed at the sideportions of the first semiconductor chip and the second semiconductorchip, are covered by a conductive layer, and the first wiring portionand the second wiring portion are electrically connected to each otherthrough the conductive layer.
 2. The semiconductor device according toclaim 1, wherein the first semiconductor chip is thinner than the secondsemiconductor chip, and wherein the second semiconductor chip isprovided as a supporting substrate which supports the firstsemiconductor chip.
 3. The semiconductor device according to claim 2,wherein in the first semiconductor chip, pixels, each of which includesa photoelectric conversion portion, are formed, and wherein thephotoelectric conversion portion is provided to receive incident lightwhich is incident from a surface of the first semiconductor chip on aside opposite to a surface thereof on which the second semiconductorchip is stacked.
 4. The semiconductor device according to claim 2,wherein the first semiconductor chip includes a semiconductor memoryelement.
 5. The semiconductor device according to claim 2, wherein thefirst semiconductor chip includes a semiconductor element which isformed on a Sal (Silicon on Insulator) substrate.
 6. The semiconductordevice according to claim 3, wherein the second semiconductor chipincludes a signal processing circuit.
 7. The semiconductor deviceaccording to claim 1, wherein the first wiring layer is stacked on thefirst semiconductor substrate, wherein the first wiring portion isformed in the first insulation layer, wherein the second wiring layer isstacked on the second semiconductor substrate and, wherein the secondwiring portion is formed in the second insulation layer.
 8. A method ofmanufacturing a semiconductor device comprising: stacking a secondsemiconductor chip on a first semiconductor chip; exposing a sidesurface of a first wiring portion, which is formed on the firstsemiconductor chip, and a side surface of a second wiring portion, whichis formed on the second semiconductor chip, at a side portion of astacked body in which the first semiconductor chip and the secondsemiconductor chip are stacked, wherein the first wiring portion isincluded in a first wiring layer of the first semiconductor chip,wherein the second wiring portion is included in a second wiring layerof the second semiconductor chip, wherein a first surface of the firstwiring layer is bonded to a first surface of the second wiring layer,wherein the first wiring portion is not exposed at the first surface ofthe first wiring layer, and wherein the second wiring portion is notexposed at the first surface of the second wiring layer; andelectrically connecting the first wiring portion and the second wiringportion to each other by providing a conductive layer so as to cover theside surfaces of the first wiring portion and the second wiring portionwhich are exposed at side portions of the first semiconductor chip andthe second semiconductor chip.
 9. The method of manufacturing thesemiconductor device according to claim 8, wherein forming of the firstsemiconductor chip includes stacking the first wiring layer, of whichthe first wiring portion is formed in an insulation layer, on a firstsemiconductor substrate, wherein forming of the second semiconductorchip includes stacking the second wiring layer, of which the secondwiring portion is formed in an insulation layer, on a secondsemiconductor substrate, and wherein in the stacking of the secondsemiconductor chip, the first wiring layer and the second wiring layerare opposed to each other, and the opposed surfaces of the firstsemiconductor chip and the second semiconductor chip are bonded to eachother.
 10. The method of manufacturing the semiconductor deviceaccording to claim 9, wherein the forming of the first semiconductorchip further includes thinning the first semiconductor substrate, andwherein in the thinning of the first semiconductor substrate, the firstsemiconductor substrate is thinned after the second semiconductor chipis stacked and supported on the first semiconductor chip in the stackingof the second semiconductor chip.
 11. The method of manufacturing thesemiconductor device according to claim 10, further comprising: exposinga surface of a first pad electrode which is formed so as to beelectrically connected to the first wiring portion at the side portionof the first semiconductor chip; and testing the first semiconductorchip by using the first pad electrode, wherein the exposing of thesurface of the first pad electrode and the testing of the firstsemiconductor chip are performed before the exposing of the sidesurfaces, and wherein when the side surfaces of the first wiring portionand the second wiring portion are exposed in the exposing of the sidesurfaces, the first pad electrode is removed.
 12. The method ofmanufacturing the semiconductor device according to claim 11, furthercomprising: exposing a surface of a second pad electrode which is formedso as to be electrically connected to the second wiring portion at theside portion of the second semiconductor chip; and testing the secondsemiconductor chip by using the second pad electrode, wherein theexposing of the surface of the second pad electrode and the testing ofthe second semiconductor chip are performed before the exposing of theside surfaces, and wherein when the side surfaces of the first wiringportion and the second wiring portion are exposed in the exposing of theside surfaces, the second pad electrode is removed.
 13. The method ofmanufacturing the semiconductor device according to claim 12, furthercomprising: providing a substrate such that the substrate is opposed toa surface of the first semiconductor chip opposite to a surface thereofon which the second semiconductor chip is stacked, wherein the providingof the substrate is performed between the testing of the firstsemiconductor chip and the exposing of the surface of the second padelectrode.
 14. An electronic apparatus comprising: a first semiconductorchip, including: a semiconductor substrate; a wiring layer having afirst wiring portion and an insulation layer, wherein the first wiringportion extends to a side surface of the wiring layer of the firstsemiconductor chip; and a second semiconductor chip that is stacked onthe first semiconductor chip, including: a semiconductor substrate; awiring layer having a second wiring portion and an insulation layer,wherein the second wiring portion extends to a side surface of thewiring layer of the second semiconductor chip, wherein opposing surfacesof the insulation layer of the first semiconductor chip and of theinsulation layer of the second semiconductor chip are bonded to oneanother, and wherein the first and second wiring portions are notexposed at the opposing surfaces of the first and second insulationlayers, and wherein the respective side surfaces of the first wiringportion and the second wiring portion, which are exposed at the sideportions of the first semiconductor chip and the second semiconductorchip, are covered by a conductive layer, and the first wiring portionand the second wiring portion are electrically connected to each otherthrough the conductive layer.